Die folgenden Begriffe wurden einbezogen:
条件付け, Konditionierung, conditioning
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2018 2nd URSI Atlantic Radio Science Meeting (AT-RASC), Gran Canaria, Spain. IEEE: 1-3; ISBN 978-1-5386-3764-7
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2018,
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2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 189-192; ISBN 978-1-5386-5063-9
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2018,
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Janca R, Jezdik P, Jahodova A, Kudr M, Benova B, Celakovsky P, Zamecnik J, Komarek V, Liby P, Tichy M, Krsek P
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J Infrared Milli Terahz Waves 39 (9): 912–925
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2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 510-514; ISBN 978-1-4673-9699-8
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Michalowska J, Tofil A, Michalowska J, Jozwik J
2018 Applications of Electromagnetics in Modern Techniques and Medicine (PTZE), Racławice, Poland. IEEE: 167-170; ISBN 978-1-5386-6937-2
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2018,
Sadowska U, Zabinski A, Tabor S
2018 Applications of Electromagnetics in Modern Techniques and Medicine (PTZE), Racławice, Poland. IEEE: 252-255; ISBN 978-1-5386-6937-2
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2018,
Daish C, Blanchard R, Duchi S, Onofrillo C, Augustine C, Fox K, Pivonka P, Pirogova E
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 4166-4169; ISBN 978-1-5386-3647-3
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2018,
Wyszkowska J, Jankowska M, Stankiewicz M
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
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2018,
Michalowska J, Tofil A, Jozwik J, Pytka J, Budzynski P, Korzeniewska E
2018 IEEE 4th International Symposium on Wireless Systems within the International Conferences on Intelligent Data Acquisition and Advanced Computing Systems (IDAACS-SWS), Lviv, Ukraine. IEEE: 162-165; ISBN 978-1-5386-7588-5
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2018,
Ashyap AYI, Dahlan SH, Abidin ZZ, Majid HA, Seman FC, Ngu X, Cholan NA
2018 IEEE International RF and Microwave Conference (RFM), Penang, Malaysia. IEEE: 69-72; ISBN 978-1-5386-6721-7
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Ramaraju S, Roula MA, McCarthy PW
J Neural Eng 15 (1): 016019
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2017 IEEE 37th Central America and Panama Convention (CONCAPAN XXXVII), Managua, Nicaragua. IEEE: 1-7; ISBN 978-1-5386-3510-0
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2018 IEEE Symposium on Product Compliance Engineering (ISPCE), San Jose, CA, USA. IEEE: 1-6; ISBN 978-1-5386-3433-2
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2018,
McDermott B, Porter E, Hughes D, McGinley B, Lang M, O'Halloran M, Jones M
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2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: 448-453; ISBN 978-1-5386-6622-7
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2018,
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2018 IEEE 2nd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: 507-512; ISBN 978-1-5386-5393-7
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2018,
Songcen W, Xiaohua H, Zishou L, Jinxing X, Fengxian W, Lei W
2018 IEEE 2nd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: 513-517; ISBN 978-1-5386-5393-7
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2018,
Padmanabhan D, Jondal ML, Hodge DO, Mehta RA, Acker NG, Dalzell CM, Kapa S, Asirvatham SJ, Cha YM, Felmlee JP, Watson Jr RE, Friedman PA
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2018,
Silemek B, Acikel V, Oto C, Alipour A, Aykut ZG, Algin O, Atalar E
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