Die folgenden Begriffe wurden einbezogen:
振幅変調, Amplitudenmodulation, AM, "amplitude modulation"
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2024,
Soleimani G, Joutsa J, Moussawi K, Siddiqi SH, Kuplicki R, Bikson M, Paulus MP, Fox MD, Hanlon CA, Ekhtiari H
Am J Psychiatry 181 (2): 100-114
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2024,
AlQhtani AZ, Al-Swedan NH, Alkhunani TA, Basalem AA, Alotaibi AM, Alsaygh KW, AlSahabi AM, Alabdulkarim AO
J Burn Care Res 45 (2): 478-486
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2024,
Kamiue M, Ito T, Tsubahara A, Kishimoto T
Am J Phys Med Rehabil 103 (1): 24-30
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2024,
Bluhm R, Sipahi ED, Achtyes ED, McCright AM, Cabrera LY
AJOB Empir Bioeth 15 (1): 11-21
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2024,
Amaechi BT, Mohseni S, Dillow AM, Abdul Azees PA, Movaghari Pour F, Kataoka Y, Restrepo MC
Eur J Dent 18 (1): 243-252
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2024,
Chen YC, Cheng CM, Li CT
Am J Ther 31 (1): e70-e72
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2023,
Rabhi R, Akbari-Chelaresi H, Olaimat M, Gharsallah A, Ramahi OM
2023 International Microwave and Antenna Symposium (IMAS), Cairo, Egypt. IEEE: S. 142-145; ISBN 978-1-6654-9076-4
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2023,
Vecheck AM, McNamee CM, Reijo Pera R, Usselman RJ
Bioengineering 11 (1): 9
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Sci Am 329 (2): S7-S9
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2023,
Abiramasundari V, Thyla B, Jose Anand A
2023 Seventh International Conference on Image Information Processing (ICIIP), Solan, India. IEEE: S. 446-449; ISBN 9798350371413
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2023,
Vanitha R, Praveena SM
2023 International Conference on New Frontiers in Communication, Automation, Management and Security (ICCAMS), Bangalore, India. IEEE: S. 1-4; ISBN 9798350317077
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2023,
Jhunjhunwala VK, Ali T, Kumar P, Malchandka AM, Srivastava S
2023 International Conference on Modeling, Simulation & Intelligent Computing (MoSICom), Dubai, United Arab Emirates. IEEE: S. 373-377; ISBN 9798350393422
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2023,
Sarkar S, Kaysir MR, Islam MJ
2023 26th International Conference on Computer and Information Technology (ICCIT), Cox's Bazar, Bangladesh. IEEE: S. 1-6; ISBN 9798350359022
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2023,
Krimi I, Ben Mbarek S, Choubani F
2023 22nd Mediterranean Microwave Symposium (MMS), Sousse, Tunisia. IEEE: S. 1-4; ISBN 9798350308488
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Strahlenschutzkommission (SSK),
1-13
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2023,
Al-Sabti SMB, Mohammed AH, Mustafa A, Saadi AM, Abdulateef AN, Atilla DG
2023 7th International Symposium on Innovative Approaches in Smart Technologies (ISAS), Istanbul, Turkiye. IEEE: S. 1-6; ISBN 9798350383072
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2023,
Chen SC, Bluhm R, Achtyes ED, McCright AM, Cabrera LY
SSM Ment Health 4: 100261
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2023,
Khan MA, Rahim AA, Sethi WT
2023 18th International Conference on Emerging Technologies (ICET), Peshawar, Pakistan. IEEE: S. 202-206; ISBN 9798350328189
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2023,
Patil N, Korenfeld O, Scalf RN, Lavoie N, Huntemer-Silveira A, Han G, Swenson R, Parr AM
Stem Cell Res Ther 14: 378
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2023,
Kim H, Lim C, Lee JS, Kim D, Song CB, Dhaher Y
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-4; ISBN 9798350324488
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2023,
Chen H, Shi H, Chen C, Jiao Y, Wang P, Chen C, Li J, Wu LF, Song T
J Appl Microbiol 134 (12): lxad302
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2023,
Gutiérrez-Muto AM, Bestmann S, Sánchez de la Torre R, Pons JL, Oliviero A, Tornero J
PLoS One 18 (11): e0292733
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2023,
Espiritu AI, Hara T, Tolledo JK, Blair M, Burhan AM
Front Psychiatry 14: 1259481
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2023,
Dufor T, Lohof AM, Sherrard RM
Int J Mol Sci 24 (22): 16456
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2023,
Khalat AM, Yahya RAM, Elsayed Azab A
SAR J Anat Physiol 4 (3): 20-32
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2023,
Miclaus S, Deaconescu DB, Vatamanu D, Buda AM
Technologies 11 (5): 113
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2023,
Jo Y, Lee E, Oh G, Gi Y, Yoon M
Am J Cancer Res 13 (10): 4734-4741
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Front Hum Neurosci 17: 1239114
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2023,
Idowu A, Adebolu O, Iyer I
Am J Cardiol 209: 55-56
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2023,
Sowder T, Sayed D, Concannon T, Pew SH, Strand NH, Abd-Elsayed A, Wie CS, Gomez Ramos DE, Raslan AM, Deer TR
J Pain Res 16: 3693-3706
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2023,
Wessel MJ, Beanato E, Popa T, Windel F, Vassiliadis P, Menoud P, Beliaeva V, Violante IR, Abderrahmane H, Dzialecka P, Park CH, Maceira-Elvira P, Morishita T, Cassara AM, Steiner M, Grossman N, Neufeld E, Hummel FC
Nat Neurosci 26 (11): 2005-2016
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2023,
Askari A, Poursadeghiyan M, Alinia A, Sephvand A, Jafarzadeh E, Nasl-Saraji G, Sahlabadi AS
Iran J Public Health 52 (10): 2157-2168
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2023,
Violante IR, Alania K, Cassarà AM, Neufeld E, Acerbo E, Carron R, Williamson A, Kurtin DL, Rhodes E, Hampshire A, Kuster N, Boyden ES, Pascual-Leone A, Grossman N
Nat Neurosci 26 (11): 1994-2004
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Facial Plast Surg Clin North Am 31 (4): 495-502
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2023,
Kanig C, Osnabruegge M, Schwitzgebel F, Litschel K, Seiberl W, Mack W, Schoisswohl S, Schecklmann M
Front Hum Neurosci 17: 1237713
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2023,
Xin Z, Abe Y, Kuwahata A, Tanaka KF, Sekino M
Brain Sci 13 (9): 1317
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2023 International Applied Computational Electromagnetics Society Symposium (ACES-China), Hangzhou, China. IEEE: S. 1-3; ISBN 9798350317909
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2023,
Chishti AR, Aziz A, Qureshi MA, Abbasi MN, Abbasi D, Iqbal SS, Azzedine Z, Algarni AM, Hussain R
IEEE Access 11: 104463-104484
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2023,
Albucker SJ, Lipner SR
J Am Acad Dermatol 89 (4): 820-822
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2023,
Che K, Wang K, Yuan Y, Li F, Li Q
Int Urogynecol J 34 (7): 1607-1617
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2023,
Anbalagan A, Sundarsingh EF, Ramalingam VS, Kapileshvar AP, Subramaniam K, Abraar AM, Manikandan E
IEEE Trans Instrum Meas 72: 1-9
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Scientific Committee on Health, Environmental and Emerging Risks (SCHEER),
1-56
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2023,
Kopacz T, Schiffarth AM, Wuschek M, Bornkessel C
Landesamt für Natur, Umwelt und Verbraucherschutz Nordrhein-Westfalen (LANUV),
LANUV-Fachbericht 143: 1-138
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2023,
Ejaz A, Jabeen I, Khan ZU, Alomainy A, Aljaloud K, Alqahtani AH, Hussain N, Hussain R, Amin Y
Micromachines 14 (6): 1169
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2023,
Woo MK, DelaBarre L, Waks M, Lagore R, Kim J, Jungst S, Eryaman Y, Ugurbil K, Adriany G
IEEE Trans Med Imaging 42 (9): 2643-2652
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2023,
Koshida T, Maruta T, Tanaka N, Hidaka K, Kurogi M, Nemoto T, Yanagita T, Takeya R, Tsuneyoshi I
Acta Med Okayama 77 (4): 359-364
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2023,
Samia AM, Thanikachalam S, Dermer H, Maddy AJ
Skinmed 21 (3): 157-163
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2023,
Wanasathop A, Nimmansophon P, Murawsky M, Krishnan DG, Li SK
Pharm Res 40 (8): 1977-1987
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2023,
Quinn DK, Upston J, Jones TR, Gibson BC, Olmstead TA, Yang J, Price AM, Bowers-Wu DH, Durham E, Hazlewood S, Farrar DC, Miller J, Lloyd MO, Garcia CA, Ojeda CJ, Hager BW, Vakhtin AA, Abbott CC
Front Psychiatry 14: 1215093
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2023,
Li K, Mollel MS, Popoola O, Sambo Y, Imran MA
2023 5th International Conference on Computer Communication and the Internet (ICCCI), Fujisawa, Japan. IEEE: S. 185-189; ISBN 9798350326963