Die folgenden Begriffe wurden einbezogen:
取り込み, Inkorporierung, Inkorporation, incorporation
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2023,
Makarov SN, Nguyen H, Meng Q, Lu H, Nummenmmaa AR, Deng ZD
J Neural Eng 20 (1): 016028
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2023,
Haussmann N, Mease R, Zang M, Stroka S, Hensel H, Clemens M
Compel - Int J Comp Math Electr Electron Eng 42 (4): 903-913
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2023,
Cleland B, Pradhan S, Madhavan S
Brain Res 1798: 148151
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2022,
Chiwande SS, Meshram P, Charde A, Bhave S
2022 International Conference on Electronics and Renewable Systems (ICEARS), Tuticorin, India. IEEE: 1865-1868; ISBN 978-1-6654-8426-8
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2022,
Shah SAA, Lim YH, Yoo H
IEEE Trans Antennas Propag 70 (3): 2214-2222
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2022,
Xu Z, Rodriguez-Villegas E
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Glasgow, Scotland, United Kingdom. IEEE: 873-876; ISBN 978-1-7281-2783-5
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2022,
Pudipeddi SS, Jayasree PVY
Eng Technol Appl Sci Res 12 (6): 9445-9449
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2022,
Gonzalez-Hernando F, Jauregi A, Villar I, Rujas A, Mir L
2022 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: 1-7; ISBN 978-1-7281-9388-5
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2022,
Kubala E, Lietz-Kijak D, Strzelecka P, Wieczorek A, Skomro P, Gronwald H
Pain Res Manag 2022: 3604386
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2022,
Wu Y, Soltani S, Sennik B, Zhou Y, Mackertich-Sengerdy G, Whiting EB, Werner DH, Jur JS
IEEE Access 10: 115338-115350
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2022,
Adhikari B, Bhandari S, Baral K, Lamichhane S, Subedi SC
Glob Ecol Conserv 38: e02258
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2022,
Ahmad A, Faisal F, Ullah S, Choi DY
Appl Sci 12 (18): 9218
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2022,
Athavale ON, Cheng LK, Clark AR, Avci R, Du P
Annu Int Conf IEEE Eng Med Biol Soc 2022: 2266-2269
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2022,
Pellegrini L, Garg K, Enara A, Gottlieb DS, Wellsted D, Albert U, Laws KR, Fineberg NA
Compr Psychiatry 118: 152339
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2022,
Lee PS, Heinemann C, Zheng K, Appali R, Alt F, Krieghoff J, Bernhardt A, Boccaccini AR, van Rienen U, Hintze V
Acta Biomater 149: 373-386
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2022,
Horikoshi S, Iwabuchi M, Kawaguchi M, Yasumasu S, Serpone N
Photochem Photobiol Sci 21 (10): 1819-1831
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2022,
Gundre SB, Ratnaparkhe VR
2022 1st International Conference on the Paradigm Shifts in Communication, Embedded Systems, Machine Learning and Signal Processing (PCEMS), Nagpur, India. IEEE: 1-6; ISBN 978-1-6654-5905-1
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2022,
Iredale E, Voigt B, Rankin A, Kim KW, Chen JZ, Schmid S, Hebb MO, Peters TM, Wong E
Med Phys 49 (9): 6055-6067
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2022,
Low JH, Chee PS, Lim EH
IEEE Trans Antennas Propag 70 (10): 9120-9129
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2022,
Amini M, Mohamedelhassan E, Liao B
Membranes 12 (6): 587
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2022,
Antal A, Luber B, Brem AK, Bikson M, Brunoni AR, Cohen Kadosh R, Dubljević V, Fecteau S, Ferreri F, Flöel A, Hallett M, Hamilton RH, Herrmann CS, Lavidor M, Loo C, Lustenberger C, Machado S, Miniussi C, Moliadze V, Nitsche MA, Rossi S, Rossini PM, Santarnecchi E, Seeck M, Thut G, Turi Z, Ugawa Y, Venkatasubramanian G, Wenderoth N, Wexler A, Ziemann U, Paulus W
Clin Neurophysiol Pract 7: 146-165
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2022,
Evers J, Sridhar K, Liegey J, Brady J, Jahns H, Lowery M
J Neural Eng 19 (4): 046004
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IEEE Ind Appl Mag 28 (3): 16-20
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2022,
Subramanian S, Sundarambal B, Karthikeyini C, Bommi RM, Jacintha V
2022 6th International Conference on Devices, Circuits and Systems (ICDCS), Coimbatore, India. IEEE: 125-129; ISBN 978-1-6654-8095-6
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2022,
Bulatov Y, Kryukov A, Suslov K
2022 9th International Conference on Electrical and Electronics Engineering (ICEEE), Alanya, Turkey. IEEE: 45-49; ISBN 978-1-6654-6755-1