Die folgenden Begriffe wurden einbezogen:
インプラント, Implantat, implant
-
2020,
Jayabharathy K, Ilakkia S
2020 7th International Conference on Smart Structures and Systems (ICSSS), Chennai, India. IEEE: 1-4; ISBN 978-1-7281-7228-6
-
2020,
Holtstiege V, Meier C, Bietenbeck M, Chatzantonis G, Florian A, Köbe J, Reinke F, Eckardt L, Yilmaz A
J Cardiovasc Magn Reson 22 (1): 35
-
2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275; ISBN 978-1-7281-7431-0
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
-
2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
-
2020,
Psenakova Z, Mydlova J, Benova M
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
-
2020,
Stojanovska J, Runge M, Mahani MG, Cronin PP, Sayyouh M, Bogun F, Ibrahim EH
AJR Am J Roentgenol 215 (2): 374-381
-
2020,
Wang B, Li J, Jin H, Chen X
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: 2516-2519; ISBN 978-1-7281-1991-5
-
2020,
Kazemivalipour E, Vu J, Lin S, Bhusal B, Nguyen BT, Kirsch J, Elahi B, Rosenow J, Atalar E, Golestanirad L
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: 6143-6146; ISBN 978-1-7281-1991-5