Die folgenden Begriffe wurden einbezogen:
インプラント, Implantat, implant
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2022,
Okada T, Akasaka T, Thuy DH, Isa T
Magn Reson Med Sci 21 (4): 531-537
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2022,
Garcia-Pallero MÁ, Cardona D, Rueda-Ruzafa L, Rodriguez-Arrastia M, Roman P
Neural Regen Res 17 (1): 59-64
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International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 63195-2-2022: 1-154, ISBN 978-1-5044-8446-6
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2021,
Aarushi, Singh A, Jha S, Nehra RK, Raghava NS
2021 6th International Conference on Signal Processing, Computing and Control (ISPCC), Solan, India. IEEE: 213-217; ISBN 978-1-6654-2555-1
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2021,
Liu K, Liu R, Cui W, Zhang K, Wang M, Fan C, Zheng H, Li E
IEEE Access 9: 117349-117357
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2021,
Jeyakumar V, Nachiappan M, Alagarsamy T
IEEE EUROCON 2021 - 19th International Conference on Smart Technologies, Lviv, Ukraine. IEEE: 51-54; ISBN 978-1-6654-3300-6
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2021,
Xu LJ, Chu ZJ, Zhu L, Xu JP, Duan Z
IEEE Trans Antennas Propag 69 (5): 2463-2472
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IEEE Trans Electromagn Compat 63 (1): 286-293
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2021,
Campi T, Cruciani S, Maradei F, Montalto A, Musumeci F, Feliziani M
IEEE Trans Med Robot Bionics 3 (4): 992-1001
-
2021,
Iqbal A, Al-Hasan M, Ben Mabrouk I, Basir A, Nedil M, Yoo H
IEEE Trans Microw Theory Tech 69 (7): 3438-3451
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2021,
Ha-Van N, Vu TL, Thuy Le M
2020 50th European Microwave Conference (EuMC), Utrecht, Netherlands. IEEE: 1115-1118; ISBN 978-1-7281-7039-8
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2021,
Adam C, Barth T, Münch M, Seide K, Krautschneider WH
2021 IEEE Biomedical Circuits and Systems Conference (BioCAS), Berlin, Germany. IEEE: 01-06; ISBN 978-1-7281-7205-7
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2021,
Mainul EA, Hossain MF
2021 International Conference on Electrical, Communication, and Computer Engineering (ICECCE), Kuala Lumpur, Malaysia. IEEE: 1-6; ISBN 978-1-6654-4602-0
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2021,
Yue S, Xia W, Yanan L, Mengjun W
2021 13th Global Symposium on Millimeter-Waves & Terahertz (GSMM), Nanjing, China. IEEE: 1-3; ISBN 978-1-6654-3744-8
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2021,
Joshi AC, Dash JC, Sarkar D
2021 IEEE Indian Conference on Antennas and Propagation (InCAP), Jaipur, Rajasthan, India. IEEE: 774-777; ISBN 978-1-6654-0111-1
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2021,
Yu Z, Chen JC, He Y, Alrashdan FT, Avants BW, Singer A, Robinson JT, Yang K
2021 IEEE Custom Integrated Circuits Conference (CICC), Austin, TX, USA. IEEE: 1-2; ISBN 978-1-7281-7582-9
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2021,
Baerov RM, Morega AM, Morega M
2021 12th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-6; ISBN 978-1-6654-4807-9
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2021,
Dörig P, Gunder N, Witt M, Welge-Lüssen A, Hummel T
HNO 69 (8): 623-632
-
2021,
Upadhyay S, Upadhya A, Salehi W, Gupta G
Mater Today Proc 45 Pt 6: 5243-5248
-
2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 697-702; ISBN 978-1-6654-4889-5
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2021,
Masapollo M, Nittrouer S, Goel J, Oh Y
JASA Express Lett 1 (10): 105202
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2021,
Mayrovitz H, Milo B, Alexander B, Mastropasqua M, Moparthi Y
Cureus 13 (1): e12801
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
E DIN EN 50527-2-3 VDE 0848-527-2-3:2021-03
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2021,
Deblieck C, Smeijers S, Morlion B, Datta A, Thomas C, Theys T
Front Pain Res 2: 753464
-
2021,
Sheh EG, Morrison TE
J ECT 37 (4): e36-e37