Die folgenden Begriffe wurden einbezogen:
"high voltage", Hochspannung, 高電圧
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2024,
Rui M, Ni H, Xie K, Xu L, Yao M
Pain Ther 13 (1): 23-32
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2024,
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IEEE Ind Appl Mag 30 (3): 61-67
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2024,
Zhang L, Zhang M, Mujumdar AS, Ma Y
Food Chem 434: 137444
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Int J Environ Health Res 34 (2): 1136-1146
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2024,
Erken B, Edipoglu IS
Neuromodulation 27 (1): 135-140
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2024,
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2023,
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23rd International Symposium on High Voltage Engineering (ISH 2023), Glasgow, UK. IET: 169-176; ISBN 978-1-83953-992-3
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IEEE Access 11: 28090-28102
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2023,
Alpaslan M, Oktay M, Kılıç E
Journal of Emergency Medicine Case Reports 14 (4): 91-92
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2023,
Buono L, Guarniere MR, Marzinotto M, Palone F, Papi L, Spezie R, Tresso G, Vacante P, Pigini A, Cortina R
2023 AEIT HVDC International Conference (AEIT HVDC), Rome, Italy. IEEE: 1-6; ISBN 9798350324907
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Eng Technol Appl Sci Res 13 (6): 12253-12257
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Eng Technol Appl Sci Res 13 (6): 12446-12451
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2023,
Kompetenzzentrum Elektromagnetische Felder (KEMF)
Bundesamt für Strahlenschutz (BfS) (Hrsg.),
Spotlight, Jun/2023 no.3: 1-3
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2023,
Mathew D, Thakral S, Setia P
Acad Forensic Pathol 13 (3-4): 110-115
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2023,
Cresci A, Durif CMF, Larsen T, Bjelland R, Skiftesvik AB, Browman HI
ICES J Mar Sci: fsad205 [im Druck]
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2023,
Song Y, Yu Z, Guan J, Wu H, Zhang J, Qiaoling L, Yuan M, Cheng X, Ling B
Anesthesiol Res Pract 2023: 8479293
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2023,
Al Salameh MSH, Al-Zughool MR
2023 24th International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: 1-4; ISBN 9798350313024
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2023,
Gao C, Zhang Z, Xu J, Gao T, Chen S, Li X
2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM), Seattle, WA, USA. IEEE: 1-7; ISBN 9798350342475
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2023,
Liu L, Liao M, Jia L, Li B, Wan W
2023 2nd International Conference on Power Electronics and Electrical Technology, Chongqing, China. Journal of Physics: Conference Series, Band 2656; IOP Publishing: 012013; ISBN 978-1-7138-8535-1
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2023,
Shi J, Guo X, Wang D, Chen B, Zhao Y, Zhang A
Electronics 12 (22): 4567
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2023,
Long Z, Zhou F, Lin F, Fan J, Li W, Diao Y, Hu K
Sensors 23 (23): 9409
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2023,
Khalat AM, Yahya RAM, Elsayed Azab A
SAR J Anat Physiol 4 (3): 20-32
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2023,
Jang JN, Park S, Park JH, Song Y, Kim YU, Kim DS, Sohn JE, Park S
Pain Physician 26 (7): E797-E804
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2023,
Bonab SA, Song W, Yazdani-Asrami M
Appl Sci 13 (20): 11180
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2023,
Sauter C, Dorn H, Hellmann-Regen J, Bueno-Lopez A, Danker-Hopfe H
Somnologie (Somnology) 27 (4): 255-264
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2023,
Dong L, Chen Y, Wang K, Li H, Di G
Int Immunopharmacol 125 Pt A: 111006
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2023,
Li Q, Ba T, Cao SJ, Chen Q, Zhou B, Yan ZQ, Hou ZH, Wang LF
Chin J Burns Wounds 39 (8): 738-745
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2023,
Hou T, Wang Z, Zhao M, Liu C, Xin M, Wu L, Zhang B
INMATEH - Agric Eng 70 (2): 517-526
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2023,
Varshney A, Semwal A, Chandra Yadav A, Mahto K, Sangwan D, Bhattarai S, Tyagi AK
Cureus 15 (9): e45443
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2023,
Gilles F, Nicot F, Boyer C, Georges JL
BMJ Case Rep 16 (10): e257010
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2023,
Qu H, Wang Y, Wang B, Li C
BMC Microbiol 23 (1): 290
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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Chin J Burns Wounds 39 (8): 718-723
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2023,
Kursawe M, Kaifie A, Krabbe J, Kimpeler S, Kühn R, Kraus T, Jankowiak K
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2023,
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Cureus 15 (8): e43951
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Acta Chir Plast 65 (2): 66-69
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Huber P, Mohanty P, Jenau F
2023 IEEE Electrical Insulation Conference (EIC), Quebec City, QC, Canada. IEEE: 1-4; ISBN 978-1-6654-9342-0
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2023,
Hasselman DJ, Hemery LG, Copping AE, Fulton EA, Fox J, Gill AB, Polagye B
Sci Total Environ 904: 166801
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2023,
Chavan PK, Autade SB, Pardeshi DB, William P
2023 5th International Conference on Inventive Research in Computing Applications (ICIRCA), Coimbatore, India. IEEE: 1714-1718; ISBN 9798350321432
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2023,
Samia AM, Thanikachalam S, Dermer H, Maddy AJ
Skinmed 21 (3): 157-163
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2023,
Hansson Mild K, Mattsson MO, Jeschke P, Israel M, Ivanova M, Shalamanova T
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Actual Jurid Ambient (134): 4-34
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2023,
Turuban M, Kromhout H, Vila J, Vallbona-Vistós M, Baldi I, Turner MC
Environ Int 180: 108156
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2023,
Nguyen A, Crespi CM, Vergara X, Kheifets L
Environ Res 238 Pt 1: 116899
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2023,
Dharanindra M, Pothineni RB, Gontla DK, P SR, Shriram Dhanasekaran K
Cureus 15 (7): e41940
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2023,
Hirota R, Teramoto A, Chiba M, Onuma M, Narimatsu H, Yotsuyanagi T, Yamashita T
Spine Surg Relat Res 7 (4): 410-413
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2023,
Zhang H, Qin B, Zhao Y, Zhang R, Zhang G
Int Wound J 20 (7): 2649-2656
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2023,
Dündar AS, Altın İ, Aksöz C, Sarın AB, Özdemir B
J Forensic Sci 68 (6): 2076-2084
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2023,
Ramirez-Bettoni E, Nemeth B
IEEE Trans Ind Appl 59 (4): 5169-5177