Die folgenden Begriffe wurden einbezogen:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
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2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
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2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1389-1396; ISBN 9798350312850
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2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
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2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: 61-64; ISBN 9798350341348
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2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: 1-4; ISBN 9798350348323
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IEEE Trans Electromagn Compat 65 (5): 1282-1291
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
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2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
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2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
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IEEE Trans Electromagn Compat 65 (4): 1090-1097
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2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
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2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
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2023,
Orlacchio R, Andrieu G, Joushomme A, Patrignoni L, Hurtier A, Poulletier de Gannes F, Lagroye I, Percherancier Y, Arnaud-Cormos D, Leveque P
IEEE Trans Electromagn Compat 65 (1): 39-50
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 606-609; ISBN 978-1-6654-0930-8
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2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166; ISBN 978-1-6654-9221-8
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2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Bundesamt für Energie (BFE),
Statusbericht 2022: 1-204
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2022,
Krupski P, Michalowska J
Prz Elektrotechniczny 98 (12): 217-220
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2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: 1-6; ISBN 978-1-6654-7147-3
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IEEE Electromagn Compat Mag 11 (3): 20-21
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2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2
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2022,
Pavel I, David V, Roman MG, Bordas AM
2022 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 484-488; ISBN 978-1-6654-8995-9