Die folgenden Begriffe wurden einbezogen:
"electromagnetic field", "Elektromagnetisches Feld", EMF, 電磁界
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2023,
Oraby T, Chakraborty S, Sivaganesan S, Kincl L, Richardson L, McBride M, Siemiatycki J, Cardis E, Krewski D
BMC Med Res Methodol 23: 225
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2023,
Baňas M, Šofranková L, Kurimský J, Pavlík M, Pikalík M, Majláthová V, Cimbala R, Pipová N, Wurfl L, Majláth I
Exp Appl Acarol 91 (3): 477-485
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2023,
Mohamed T, Melfi V, Colciago A, Magnaghi V
Cell Death Dis 14 (9): 629
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Cvetković M, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-6; ISBN 9798350301076
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2023,
Kapetanović A, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-5; ISBN 9798350301076
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2023,
Zhang B, Yamauchi Y, Galigekere VP, Onar OC, Mohammad M
2023 IEEE Transportation Electrification Conference & Expo (ITEC), Detroit, MI, USA. IEEE: 1-6; ISBN 9798350397437
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2023,
Walter J, Hader M, Sengedorj A, Fietkau R, Frey B, Gaipl US
Int J Hyperthermia 40 (1): 2265590