Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Wang S, Xie Y, Shang S, Hao X, Lu X
2020 6th Global Electromagnetic Compatibility Conference (GEMCCON), XI'AN, China. IEEE: S. 1-5; ISBN 978-1-7281-8464-7
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2020,
Zhang W, Song G, Zhao Q, Qi X
2020 6th Global Electromagnetic Compatibility Conference (GEMCCON), XI'AN, China. IEEE: S. 1-4; ISBN 978-1-7281-8464-7
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2020,
Bejenaru O, Lazarescu C, Ursachianu MV, Salceanu A
2020 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: S. 322-326; ISBN 978-1-7281-8127-1
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2020,
Balawender K, Orkisz S
Cent European J Urol 73 (4): 563-568
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020,
Dergham I, Martinez Rocha JC, Imad R, Alayli Y
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-6; ISBN 978-1-7281-5580-7
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2020,
Ramos V, Trillo AM, Suarez OJ, Suarez S, Febles VM, Rabassa LE, Karpowicz J, Fernandez de Aldecoa JC, Hernandez JA
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020,
Simonazzi M, Sandrolini L, Reggiani U
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020,
Song X, Yue Y, Zhu X, Chang H
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Bonato M, Dossi L, Chiaramello E, Fiocchi S, Gallucci S, Tognola G, Ravazzani P, Parazzini M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Miwa K, Takenaka T, Hirata A
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Onishi T, Niskala K, Christ A, Roman J
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Gravina A, Moglie F, Bastianelli L, Mariani Primiani V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-6; ISBN 978-1-7281-5580-7
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2020,
Cruciani S, Campi T, Maradei F, Feliziani M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Kamimura Y, Daimon K, Matsumoto N, Kimura S, Sato K
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020,
Lämmle T, Parspour N, Mönch M
2020 5th International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: S. 1-6; ISBN 978-1-7281-7363-4
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2020,
Asadi R, Aliakbarian H, Khayambashi G, Majdolashrafi P
IEEE Electromagn Compat Mag 9 (3): 45-54
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2020,
Dinarević EC, Poljak D, Blažević Z
2020 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: S. 1-4; ISBN 978-1-7281-7538-6
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IEEE Electromagn Compat Mag 9 (3): 96-99
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2020,
Xia M, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 257-260; ISBN 978-1-7281-7431-0
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2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
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2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 270-275; ISBN 978-1-7281-7431-0
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2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 623-625; ISBN 978-1-7281-7431-0
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2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 261-265; ISBN 978-1-7281-7431-0
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 266-269; ISBN 978-1-7281-7431-0
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 659-662; ISBN 978-1-7281-7431-0
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2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: S. 1-6; ISBN 978-1-7281-7543-0
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2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
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2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: S. 1-5; ISBN 978-1-7281-4591-4
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IEEE Electromagn Compat Mag 9 (2): 27-29
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IEEE Trans Electromagn Compat 62 (4): 1443-1450
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2020,
Brizi D, Fontana N, Tucci M, Barmada S, Monorchio A
IEEE Trans Electromagn Compat 62 (4): 1312-1322
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2020,
Rashed EA, Diao Y, Tanaka S, Sakai T, Gomez-Tames J, Hirata A
IEEE Trans Electromagn Compat 62 (6): 2704-2713
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2020,
Gusarov AV, Rostovtsev VL, Safonov LV, Shurygin SN
Zh Nevrol Psikhiatr Im S S Korsakova 120 (2): 76-80
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2020,
Arduino A, Bottauscio O, Chiampi M, Giaccone L, Liorni I, Kuster N, Zilberti L, Zucca M
IEEE Trans Electromagn Compat 62 (5): 1939-1950
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2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
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2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
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2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
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2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
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2020,
Attaran A, Handler WB, Chronik BA
IEEE Trans Electromagn Compat 62 (1): 186 - 193
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IEEE Trans Electromagn Compat 62 (2): 338-345
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2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: S. 169-172; ISBN 978-1-7281-0595-6
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2019,
Ruddle AR, Martin AJM
IEEE Electromagn Compat Mag 8 (3): 75-85
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 78-81; ISBN 978-1-7281-1639-6