Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2002,
Hirata A, Watanabe H, Shiozawa T
IEEE Trans Electromagn Compat 44 (4): 592-594
-
2002,
Kanda M, Balzano Q, Russo P, Faraone A, Bit-Babik G
IEEE Trans Electromagn Compat 44 (1): 4-10
-
2002,
Santomauro M, Da Prato D, Ottaviano L, Borrelli A, Chiariello M
Ital Heart J Suppl 3 (4): 440-445
-
IEEE Trans Electromagn Compat 44 (1): 148-151
-
2002,
Altman Z, Begasse B, Dale C, Karwowski A, Wiart J, Wong MF
IEEE Trans Electromagn Compat 44 (4): 588-592
-
2001,
Geller L, Thuroczy G, Merkely B
Orv Hetil 142 (36): 1963-1970
-
J Microw Power Electromagn Energy 36 (4): 199-215
-
2001,
Lyznicki JM, Altman RD, Williams MA
Biomed Instrum Technol 35 (3): 189-195
-
2001,
Kainz W, Neubauer G, Alesch F, Schmid G, Jahn O
Wien Klin Wochenschr 113 (23-24): 903-914
-
2000,
Reyhani SMS, Glover RJ
Electromagnetics 20 (2): 141-153
-
2000,
Hirata A, Matsuyama SI, Shiozawa T
IEEE Trans Electromagn Compat 42 (4): 386-393
-
2000,
Wiart J, Dale C, Bosisio AV, Le Cornec A
IEEE Trans Electromagn Compat 42 (4): 376-385
-
2000,
Caputa K, Stuchly MA, Skopec M, Bassen HI, Ruggera P, Kanda M
IEEE Trans Microw Theory Tech 48 (11): 2148-2154
-
2000,
Gilligan P, Somerville S, Ennis JT
Br J Radiol 73 (873): 994-998
-
1999,
Shimizu HO, Shimizu K
1999 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.99EX147), Tokyo, Japan. IEEE: S. 169-172; ISBN 978-4-9980748-4-7
-
1999,
Hansen VW, Bitz AK, Streckert JR
IEEE Trans Electromagn Compat 41 (4): 487-493
-
Deutsches Ärzteblatt 96 (13): A-845-A-852
-
1999,
Davis D, Segal B, Pavlasek T
Biomed Instrum Technol 33 (5): 411-416
-
Biomed Tech 43: 218-219
-
1998,
Schlegel RE, Grant FH, Raman S, Reynolds D
Biomed Instrum Technol 32 (6): 645-655
-
1997,
Watson DB, Sedcole NP, Chan E, Smart KG, Patel SM
IET 10th International Conference on (Conf. Publ. No. 445) Electromagnetic Compatibility, 1997. IET: S. 54-58
-
1997,
Brinkmann K, Friedrich G
VDE-Verlag; ISBN 978-3-8007-2294-5
-
IEEE Trans Electromagn Compat 39 (1): 55-61
-
1997,
Bernardi P, Cavagnaro M, Pisa S
IEEE Trans Electromagn Compat 38 (3): 357-366
-
1996,
Kimura K, Arisawa J
EMC'96 ROMA International Symposium on Electromagnetic Compatibility, Rome, Italy. IEEE: S. 523-526; ISBN 9798331500009