Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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Med Device Technol 15 (8): 33-4, 36
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2004,
Ayata A, Mollaoglu H, Yilmaz HR, Akturk O, Özgüner F, Altuntas I
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2004,
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2004,
Cicchetti R, Faraone A
IEEE Trans Electromagn Compat 46 (2): 275-290
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2004,
Yamazaki K, Kawamoto T, Fujinami H, Shigemitsu T
IEEE Trans Electromagn Compat 46 (1): 115-120
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2004,
Kivekas O, Ollikainen J, Lehtiniemi T, Vainikainen P
IEEE Trans Electromagn Compat 46 (1): 71-86
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2004,
Koulouridis S, Nikita KS
IEEE Trans Electromagn Compat 46 (1): 62-70
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2004,
Metwally IA, Zischank WJ, Heidler FH
IEEE Trans Electromagn Compat 46 (2): 208-221
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IEEE Trans Electromagn Compat 46 (2): 268-274
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2004,
Carlberg U, Kildal PS, Wolfgang A, Sotoudeh O, Orlenius C
IEEE Trans Electromagn Compat 46 (2): 146-154
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2004,
Wallin MK, Wajntraub S
Anesth Analg 98 (3): 763-767
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2003,
Ruddle AR, Topham DA, Ward DD
2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446), Boston, MA, USA. Band 2; IEEE: S. 543-547; ISBN 978-0-7803-7835-3
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2003,
Poljak D, Tham CY, Gandhi O, Sarolic A
IEEE Trans Electromagn Compat 45 (1): 141-145
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2003,
Hirata A, Morita M, Shiozawa T
IEEE Trans Electromagn Compat 45 (1): 109-116
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2003,
Malaric K, Bartolic J
Turk J Elec Eng & Comp Sci 11 (2): 143-154
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Polit Zeitgesch 53 (B42): 35-46
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2003,
Joseph W, Martens L
IEEE Trans Electromagn Compat 45 (2): 339-349
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IEEE Trans Electromagn Compat 45 (2): 330-338
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2003,
Matsumoto Y, Takeuchi M, Fujii K, Sugiura A, Yamanaka Y
IEEE Trans Electromagn Compat 45 (3): 561-566
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Arch Mal Coeur Vaiss 96 (Spec. III): 65-70
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Arch Mal Coeur Vaiss 96: 57-64
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2003,
Nadi M, Hedjiedj A, Joly L, Schmitt P, Dodinot B, Aliot E
Arch Mal Coeur Vaiss 96 (Spec. III): 22-29
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2002,
Fung LC, Leung SW, Chan KH
2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, USA. Band 2; IEEE: S. 656-661; ISBN 978-0-7803-7264-1
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2002,
Seker SS, Demirbilek BO, Morgul A
2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, USA. Band 2; IEEE: S. 662-666; ISBN 978-0-7803-7264-1
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2002,
Hedjiedj A, Goeury C, Nadi M
J Med Eng Technol 26 (5): 223-227