Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 365-368; ISBN 9798350360400
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2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 604-607; ISBN 9798350360400
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2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 359-364; ISBN 9798350360400
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2024,
Cvetković M, Poljak D, Dodig H
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 167-172; ISBN 9798350360400
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 446-449; ISBN 9798350360400
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2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53
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2024,
Jacksha RD, Sunderman CB, Zhou C
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 205-210; ISBN 9798350360400
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2024,
Xiao S, Zhang ZQ, Su TZ, Zhang JB, Xiao Jia
2024 International Conference on Electromagnetics in Advanced Applications (ICEAA), Lisbon, Portugal. IEEE: S. 250-253; ISBN 9798350360981
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2024,
Pandeya M, Solanki MS, Suresh VG
2024 2nd World Conference on Communication & Computing (WCONF), RAIPUR, India. IEEE: S. 1-5; ISBN 9798350395334
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2024,
Cruciani S, Campi T, Maradei F, Feliziani M
Energies 17 (17): 4233