Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Bundesamt für Energie (BFE),
1-125
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Mishra SK, Chowdhary R, Kumari S, Rao SB
J Clin of Diagn Res 11 (5): ZE01-ZE05
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2017,
Capstick MH, Kuehn S, Berdinas-Torres V, Gong Y, Wilson PF, Ladbury JM, Koepke G, McCormick DL, Gauger J, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (4): 1041-1052
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2017,
Gong Y, Capstick M, Kuehn S, Wilson P, Ladbury J, Koepke G, McCormick DL, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (6): 1798-1808
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2017,
Takei R, Nagaoka T, Saito K, Watanabe S, Takahashi M
IEEE Trans Electromagn Compat 59 (2): 747-753
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2017,
Wake K, Laakso I, Hirata A, Chakarothai J, Onishi T, Watanabe S, De Santis V, Feliziani M, Taki M
IEEE Trans Electromagn Compat 59 (2): 677 - 685
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2017,
Laakso I, Morimoto R, Hirata A
IEEE Trans Electromagn Compat 59 (2): 739-746
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2017,
Senic D, Sarolic A, Holloway CL, Ladbury JM
IEEE Trans Electromagn Compat 59 (3): 813 - 822
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2017,
Cheng X, Monebhurrun V
IEEE Trans Electromagn Compat 59 (1): 14-23
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2017,
Yao L, Shen T, Kang N, Huang J, Liu D, Zhang F, Sun H
IEEE Trans Electromagn Compat 59 (2): 352 - 359
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IEEE Trans Electromagn Compat 59 (2): 360 - 366
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2017,
Hwang JH, Kang TW, Kwon JH, Park SO
IEEE Trans Electromagn Compat 59 (1): 48-57
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2017,
Lopez DG, Ignatenko M, Filipovic DS
IEEE Trans Electromagn Compat 59 (1): 43-47
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2017,
Il Kwak S, Sim DU, Kwon JH, Yoon YJ
IEEE Trans Electromagn Compat 59 (1): 297-300
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2016,
Frezzi P, Hug R, Grant J, Klingler A
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: S. 876-881; ISBN 978-1-5090-1417-0
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2016,
Rachedi BA, Babouri A, Xun Z
Rev Roum Sci Techn – Électrotechn et Énerg 61 (2): 178-182
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2016,
Yavolovskaya E, Chiqovani G, Gabriadze G, Iosava S, Svanidze L, Willmann B, Jobava R
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: S. 491-196; ISBN 978-1-5090-1417-0
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2016,
Lisewski T, Mikolajczyk A, Abramik S, Rucinski M
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: S. 497-500; ISBN 978-1-5090-1417-0
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2016,
Karpowicz J, Bienkowski P, Kieliszek J
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: S. 668-671; ISBN 978-1-5090-1417-0
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2016,
Karpowicz J, Kieliszek J, Sobiech J, Gryz K, Puta R
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Wroclaw, Poland. IEEE: S. 760-764; ISBN 978-1-5090-1417-0