Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: S. 1-4; ISBN 978-1-7281-5693-4
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2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
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2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
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2019,
Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
J Sci Arts No.1 (46): 249-259
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2019,
Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
IEEE Trans Electromagn Compat 61 (5): 1423-1431
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2019,
Botsa VR, Kumar Munaka S, Dushyanth M, Bandaru S
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON), Bangalore, India. IEEE: S. 1-4; ISBN 978-1-7281-4153-4
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2019,
Katkoria V, Ghosh P, Chaudhury B
2019 IEEE MTT-S International Microwave and RF Conference (IMARC), Mumbai, India. IEEE: S. 1-5; ISBN 978-1-7281-4041-4
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2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: S. 1507-1512; ISBN 978-1-7281-1676-1
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2019,
Cruciani S, Campi T, Maradei F, Feliziani M
2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), London, United Kingdom. IEEE: S. 173-176; ISBN 978-1-7281-0881-0
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2019,
Geyikoglu MD, Koc Polat H, Cavusoglu B
2019 Fifth International Electromagnetic Compatibility Conference (EMC Turkiye), Kocaeli, Turkey. IEEE: S. 1-5; ISBN 978-1-7281-1836-9
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2019,
Ren X, Liu W, Su Z, Wu H, Qiao S, Lu H, Shen G
2019 12th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Suzhou, China. IEEE: S. 1-5; ISBN 978-1-7281-4853-3
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2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: S. 210-212; ISBN 978-1-7281-4263-0
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2019,
Songcen W, Bin W, Xiaokang W, Chong X, Jinxing X, Weimei G, Jiaqi X
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: S. 1-7; ISBN 978-1-7281-3399-7
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2019,
Viorica V, Mircea-Emilian A, Paul N, Florel R
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: S. 1-5; ISBN 978-1-7281-4012-4
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2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-5; ISBN 978-1-7281-3711-7
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2019,
Kozlov M, Angelone LM, Rajan S
IEEE Trans Electromagn Compat: 2311-2316
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 162-165; ISBN 978-1-7281-1639-6
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 43-46; ISBN 978-1-7281-1639-6
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 766-769; ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 166-169; ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 750-753; ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 691-694; ISBN 978-1-7281-1639-6
