Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53
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2024,
Jacksha RD, Sunderman CB, Zhou C
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: S. 205-210; ISBN 9798350360400
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2024,
Xiao S, Zhang ZQ, Su TZ, Zhang JB, Xiao Jia
2024 International Conference on Electromagnetics in Advanced Applications (ICEAA), Lisbon, Portugal. IEEE: S. 250-253; ISBN 9798350360981
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2024,
Pandeya M, Solanki MS, Suresh VG
2024 2nd World Conference on Communication & Computing (WCONF), RAIPUR, India. IEEE: S. 1-5; ISBN 9798350395334
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2024,
Cruciani S, Campi T, Maradei F, Feliziani M
Energies 17 (17): 4233
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2024,
Akter MK, Guo R, Islam MZ, Zheng J, Kainz W, Long SA, Chen J
IEEE Trans Electromagn Compat 66 (4): 1041-1056
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2024,
Esmaeili H, Yang C, Schuster C
IEEE Trans Electromagn Compat [im Druck]
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Access 12: 109750-109758
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2024,
Di Capua G, Maffucci A, Capriglione D, Di Mambro G, Femia N, Oliva N, De Guglielmo L
2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy. IEEE: S. 1-6; ISBN 9798350370546
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2024,
Ishida K, Fujii K, Hanada E
J Med Syst 48 (1): 72
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2024,
Li B, Zhang X, Qiao N, Chen J, Bi W, Zhi W, Ma L, Miao C, Wang L, Zou Y, Hu X
Bioelectromagnetics 45 (7): 338-347
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2024,
Li J, Dengyu Z, Yujie Z, Yuechen G
2024 IEEE 7th International Electrical and Energy Conference (CIEEC), Harbin, China. IEEE: S. 3488-3491; ISBN 9798350359565
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2024,
Zhan L, Shi D, Zhou X, Gou Y
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: S. 159-162; ISBN 9798350349498
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2024,
Sufian MA, Abbas A, Choi D, Lee J, Hussain N, Kim N
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: S. 247-249; ISBN 9798350349498
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2024,
Kuster N, Xi J, Christ A
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: S. 251-254; ISBN 9798350349498
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2024,
Censi F, Vivarelli C, Mattei E, Calcagnini G, Bogi A, Comelli M, Zoppetti N, Burriesci G, D’Agostino S, Falsaperla R
2024 4th URSI Atlantic Radio Science Meeting (AT-RASC), Meloneras, Spain. IEEE, Spanien: S. 1-4; ISBN 9798350360257
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2024,
Diao Y, Kodera S, Li K, Hirata A
IEEE Trans Electromagn Compat 66 (5): 1351-1360
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Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D4, Aug 2024: 1-65, ISBN 9798855712186
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Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D3, Jun 2024: 1-65, ISBN 9798855709759
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2024,
Ali Hamed SM, Alsaif H
IEEE Access 12: 89353-89362
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2024,
Yang X, Guo R, Zheng J, Chen X, Chen J
IEEE Trans Electromagn Compat 66 (4): 1029-1040
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2024,
Dianovský R, Pecho P, Hrúz M, Velký P
2024 New Trends in Civil Aviation (NTCA), Prague, Czech Republic. IEEE: S. 133-139; ISBN 9798350317961
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat 66 (3): 1015-1028
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat 66 (3): 706-719