Die folgenden Begriffe wurden einbezogen:
"electric field", "Elektrisches Feld", EF, 電界
-
2019,
Soni VS, Yanagihara TK
Cancer Imaging 19 (1): 76
-
J Chem Phys 151 (20): 204101
-
2019,
Kasten FH, Duecker K, Maack MC, Meiser A, Herrmann CS
Nat Commun 10: 5427
-
2019,
Lorenzo MF, Thomas SC, Kani Y, Hinckley J, Lee M, Adler J, Verbridge SS, Hsu FC, Robertson JL, Davalos RV, Rossmeisl Jr JH
Cancers 11 (12): E1850
-
2019,
Arnold CE, Rajnicek AM, Hoare JI, Pokharel SM, McCaig CD, Barker RN, Wilson HM
Sci Rep 9: 17604
-
2019,
Iwasa SN, Rashidi A, Sefton E, Liu NX, Popovic MR, Morshead CM
eNeuro 6 (6): ENEURO.0382-19.2019
-
2019,
Matković A, Šarolić A
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-4; ISBN 978-1-7281-3711-7
-
2019,
Bejenaru O, Lunca E, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: S. 1-4; ISBN 978-1-7281-4012-4
-
2019,
Bailey WH, Bodemann R, Bushberg J, Chou CK, Cleveland R, Faraone A, Foster KR, Gettman KE, Graf K, Harrington T, Hirata A, Kavet R, Keshvari J, Klauenberg BJ, Legros A, Maxson DP, Osepchuk JM, Reilly JP, Tell RA, Thansandote A, Yamazaki K, Ziskin MC, Zollman PM
IEEE Access 7: 171346-171356
-
2019,
Caramazza L, De Angelis A, Della Valle E, Denzi A, Nardoni M, Paolicelli P, Petralito S, Apollonio F, Liberti M
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: S. 220-223; ISBN 978-1-7281-1798-0
-
2019,
Li H, Liu S, Yang X, Du Y, Luo J, Tan J, Sun Y
Int J Mol Sci 20 (23): E5847
-
Bundesamt für Strahlenschutz (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-154/19: 1-94
-
2019,
Scarfì MR, Mattsson MO, Simkó M, Zeni O
Int J Environ Res Public Health 16 (22): E4548
-
2019,
Kozlov M, Angelone LM, Rajan S
IEEE Trans Electromagn Compat: 2311-2316
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 83-86; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 162-165; ISBN 978-1-7281-1639-6
-
2019,
Rubin AE, Usta OB, Schloss R, Yarmush M, Golberg A
Adv Wound Care 8 (4): 136-148
-
Biomicrofluidics 13 (6): 064107
-
2019,
Morales-Quezada L, El-Hagrassy MM, Costa B, McKinley RA, Lv P, Fregni F
Front Hum Neurosci 13: 388
-
2019,
Nimpf S, Nordmann GC, Kagerbauer D, Malkemper EP, Landler L, Papadaki-Anastasopoulou A, Ushakova L, Wenninger-Weinzierl A, Novatchkova M, Vincent P, Lendl T, Colombini M, Mason MJ, Keays DA
Curr Biol 29 (23): 4052-4059.e4
-
2019,
Bodemann R, Finke J, von Freeden J, Gritsch T, Heinrich H, Hoffmann M, Jeschke P, Joosten S, Krischek R, Reidenbach HD, Schiessl K, Schreiber M, Schühle E, Storch D, Stunder D
Fachverband für Strahlenschutz e. V. (FS),
FS-2019-180-AKNIR: 1-111
-
2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: S. 1-5; ISBN 978-1-7281-1899-4
-
2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: S. 1-3; ISBN 978-1-7281-2063-8
-
2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 43-46; ISBN 978-1-7281-1639-6
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030