Die folgenden Begriffe wurden einbezogen:
"T wave", T-Welle, T-Zacke, T波
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2023,
Wang S, Song Z, Kang J, Guo G
AIP Adv 13 (9): 095209
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2023,
Li K, Hikage T, Masuda H, Ijima E, Nagai A, Taguchi K
Sci Rep 13: 17397
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2023,
Akbari H, Taghavi L, Hossaini SKE, Gholami-Fesharaki M, Mirzahosseini SAH
Trauma Mon 28 (4): 876-881
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2023,
Linnemann C, Sahin F, Chen Y, Falldorf K, Ronniger M, Histing T, Nussler AK, Ehnert S
Int J Mol Sci 24 (19): 14629
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2023,
Rahimi S, Ahrabi M, Samiei M, Roshangar L, Ahrabi B, Hashemi B, Shahi S, Rahimi Darehchi N
Iran Endod J 18 (4): 218-223
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2023,
Adda S, Chiaraviglio L, Franci D, Lodovisi C, Pasquino N, Pavoncello S, Pedroli C, Pelosini R
IEEE Trans Instrum Meas 72: 5504410
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2023,
Benfedala S, Valero A, Brahmi F, Belbahi A, Kernou ON, Adjeroud-Abdellatif N, Abbou A, Madani K
Food Sci Technol Int: 10820132231205622 [im Druck]
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2023,
Oraby T, Chakraborty S, Sivaganesan S, Kincl L, Richardson L, McBride M, Siemiatycki J, Cardis E, Krewski D
BMC Med Res Methodol 23: 225
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2023,
Baňas M, Šofranková L, Kurimský J, Pavlík M, Pikalík M, Majláthová V, Cimbala R, Pipová N, Wurfl L, Majláth I
Exp Appl Acarol 91 (3): 477-485
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Cvetković M, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-6; ISBN 9798350301076
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2023,
Kapetanović A, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-5; ISBN 9798350301076
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2023,
Zhang B, Yamauchi Y, Galigekere VP, Onar OC, Mohammad M
2023 IEEE Transportation Electrification Conference & Expo (ITEC), Detroit, MI, USA. IEEE: S. 1-6; ISBN 9798350397437
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2023,
Walter J, Hader M, Sengedorj A, Fietkau R, Frey B, Gaipl US
Int J Hyperthermia 40 (1): 2265590
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2023,
Zhong H, Xing C, Zhou M, Jia Z, Liu S, Zhu S, Li B, Yang H, Ma H, Wang L, Zhu R, Qu Z, Ning G
Acta Biochim Biophys Sin 55 (11): 1718 - 1729
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Facial Plast Surg Clin North Am 31 (4): 495-502
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2023,
De la Cruz J, Benzecry Almeida D, Silva Marques M, Ramina R, Fortes Kubiak RJ
Cureus 15 (9): e44922
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2023,
Goutman SA, Savelieff MG, Jang DG, Hur J, Feldman EL
Nat Rev Neurol 19 (10): 617-634
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2023,
Luan D, Li S, Wang Y, Wang Y
Food Res Int 173 Pt 2: 113352
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2023,
Kang SY, Cho ER, Kang DH
Food Res Int 173 Pt 1: 113231
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2023,
Jeladze V, Thielens A, Nozadze T, Korkotadze G, Partsvania B, Zaridze R
2023 IEEE XXVIII International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: S. 180-185; ISBN 9798350315349
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2023,
Liu WL, Wang H, Hu YM, Wang XM, Chen HQ, Tu ZC
J Agric Food Chem 71 (41): 15363-15374
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2023,
Yao S, Wang S, Zheng M, Wang Z, Liu Z, Wang ZL, Li L
Adv Mater 35 (40): e2303962
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2023,
Sadeghi-Tarakameh A, DelaBarre L, Zulkarnain NIH, Harel N, Eryaman Y
Magn Reson Med 90 (6): 2627-2642