Die folgenden Begriffe wurden einbezogen:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
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2017,
Rumeng T, Senwen L, Tong W, Shaochuan C
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE: S. 1-5; ISBN 978-1-5090-5186-1
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2017,
Beiu C, Toader C, Golovanov N, Buica G
2017 International Conference on Electromechanical and Power Systems (SIELMEN), Iasi, Romania. IEEE: S. 179-183; ISBN 978-1-5386-1847-9
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2017,
Park J, Kim D, Hwang K, Park HH, Kwak SI, Kwon JH, Ahn S
IEEE Trans Electromagn Compat 59 (2): 695 - 703
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2017,
Mazurek PA, Pawlat J, Kwiatkowski M, Terebun P
2017 International Conference on Electromagnetic Devices and Processes in Environment Protection with Seminar Applications of Superconductors (ELMECO & AoS), Naleczow, Poland. IEEE: S. 1-4; ISBN 978-1-5386-1944-5
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2017,
Kurnaz C, Yildiz D, Karagöl S
2017 18th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF) Book of Abstracts, Lodz, Poland. IEEE: S. 1-2; ISBN 978-1-5386-1662-8
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2017,
Laakso I, Murakami T
2016 URSI Asia-Pacific Radio Science Conference (URSI AP-RASC), Seoul, Korea (South). IEEE: S. 733-736; ISBN 978-1-4673-9983-8
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2017,
Wake K, Chakarothai J, Aoki Y, Arima T, Uno T, Watanabe S
2016 International Symposium on Antennas and Propagation (ISAP), Okinawa, Japan. IEEE: S. 516-517; ISBN 978-1-4673-7960-1
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2017,
Chakarothai J, Wake K, Watanabe S
2016 International Symposium on Antennas and Propagation (ISAP), Okinawa, Japan. IEEE: S. 470-471; ISBN 978-1-4673-7960-1
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2017,
Ostafin M, Miernik A, Drozdz T, Nawara P, Gliniak M, Kielbasa P, Tabor S
2017 Progress in Applied Electrical Engineering (PAEE), Koscielisko, Poland. IEEE: S. 1-5; ISBN 978-1-5386-1529-4
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2017,
Mittal L, Raman V, Camarillo IG, Garner AL, Fairbanks AJ, Dunn GA, Sundararajan R
2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), Fort Worth, TX, USA. IEEE: S. 596-599; ISBN 978-1-5386-1195-1