Die folgenden Begriffe wurden einbezogen:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
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International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62704-1:2017: 1-86, ISBN 978-1-5044-4259-6
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2017,
Mohammed B, Jin J, Abbosh A, Bialkowski K, Manoufali M, Crozier S
IEEE Access 5: 27345 - 27353
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2017,
Kouzani AZ, Kale RP, Zarate-Garza PP, Berk M, Walder K, Tye SJ
IEEE Trans Neural Syst Rehabil Eng 25 (9): 1365-1374
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2017,
Huang X, Zheng K, Kohan S, Denprasert PM, Liao L, Loeb GE
IEEE Trans Neural Syst Rehabil Eng 25 (7): 1068-1078
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2017,
Chen G, Zhao L, Yu W, Jin JM
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, San Diego, CA, USA. IEEE; ISBN 978-1-5386-0898-2
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2017,
Li J, Yan S, Liu Y, Jin JM, Hochwald BM
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, San Diego, CA, USA. IEEE; ISBN 978-1-5386-0898-2
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Patiño M, Rangel RA, Balbastre-Tejedor JV, Alfonso CD, López ZY, Vega F, Pantoja JJ
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, San Diego, CA, USA. IEEE; ISBN 978-1-5386-0898-2
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2017 40th International Conference on Telecommunications and Signal Processing (TSP), Barcelona. IEEE; ISBN 978-1-5090-3983-8
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2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2