Die folgenden Begriffe wurden einbezogen:
"Elektromagnetisches Feld", EMF, "electromagnetic field", 電磁界
-
Dose Response 18 (3): 1559325820959557
-
2020,
Vinhas A, Rodrigues MT, Gonçalves AI, Reis RL, Gomes ME
Acta Biomater 117: 235-245
-
2020,
Jayabharathy K, Ilakkia S
2020 7th International Conference on Smart Structures and Systems (ICSSS), Chennai, India. IEEE: 1-4; ISBN 978-1-7281-7228-6
-
2020,
Konstantinos S, Vikelis M, Rapoport A
J Neuroophthalmol 40 (4): 472-484
-
2020,
Yang C, Xu H, Wang R, Liu Y, Wang S
Ann Palliat Med 9 (5): 3357-3365
-
2020,
Lola Costa EV, Silva Araújo VFD, Pereira Santos AP, de Albuquerque Nogueira R
Electromagn Biol Med 39 (4): 403-410
-
2020,
Górski R, Kotwicka M, Skibińska I, Jendraszak M, Wosiński S
Ann Agric Environ Med 27 (3): 427-434
-
2020,
Adda S, Aureli T, Coltellacci S, D’elia S, Franci D, Grillo E, Pasquino N, Pavoncello S, Suman R, Vaccarono M
IEEE Access 8: 171956-171967
-
2020,
Mahanta D, Bordoloi H, Saikia SJ
2020 International Conference on Computational Performance Evaluation (ComPE), Shillong, India. IEEE: 632-636; ISBN 978-1-7281-6645-2
-
2020,
Tariq RU, Ye M, Cao Z, He Y
2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China. IEEE: 1-3; ISBN 978-1-7281-6065-8
-
2020,
Supriya A, Ashok Kumar S, Shanmuganantham T
2020 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT), Bangalore, India. IEEE: 1-3; ISBN 978-1-7281-6829-6
-
2020,
Magiera A, Solecka J
Rocz Panstw Zakl Hig 71 (3): 251-259
-
2020,
Yahyazadeh A, Altunkaynak BZ
Biomed Environ Sci 33 (8): 593-602
-
2020,
Zhao D, Feng PJ, Liu JH, Dong M, Shen XQ, Chen YX, Shen QD
Adv Mater 32 (43): e2003800
-
2020,
Eggert T, Dorn H, Sauter C, Schmid G, Danker-Hopfe H
Environ Res 191: 110173
-
2020,
Agudelo DA, Chávez JS, Ramírez JS, Araque JL
2020 International Applied Computational Electromagnetics Society Symposium (ACES), Monterey, CA, USA. IEEE: 1-2; ISBN 978-1-7281-6285-0
-
2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275; ISBN 978-1-7281-7431-0
-
2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
-
2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 266-269; ISBN 978-1-7281-7431-0
-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
-
2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
-
2020,
Psenakova Z, Beňová M, Lauková T
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
-
2020,
Psenakova Z, Mydlova J, Benova M
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
-
2020,
Gombarska D, Smetana M, Vaverka F, Drozdikova Z
2020 ELEKTRO, Taormina, Italy. IEEE: 1-5; ISBN 978-1-7281-7543-0