Simulation Study on Coil Design for Transcranial Magnetic Stimulation tech./dosim.

[Simulationsstudie zum Spulendesign für die transkranielle Magnetstimulation]

Veröffentlicht in: 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE, 2018: S. 2174-2177; ISBN 978-1-5386-3647-3

Exposition