キーワード:
電磁界, "Elektromagnetisches Feld", EMF, "electromagnetic field"
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2023,
Al-Sabti SMB, Hamdi MM, Abdulateef AN, Hmad SS, Samir AS, Ali MD
2023 7th International Symposium on Innovative Approaches in Smart Technologies (ISAS), Istanbul, Turkiye. IEEE: 1-6; ISBN 9798350383072
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2023,
Obajuluwa AO, Lech JC, Amina D, Onwuka CC, Bolarinwa RA, Obajuluwa TM, Fafure AA, Krüger TPJ, Afolabi OB, Anish A, Emoruwa O, Baker M
Egypt J Basic Appl Sci 10 (1): 835-845
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2023,
Liu Q, Zhao H, Zhang H, Yuan Y
2023 5th International Conference on Intelligent Control, Measurement and Signal Processing (ICMSP), Chengdu, China. IEEE: 241-245; ISBN 9798350336047
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: 1-6; ISBN 9798350304015
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2023,
Zhao X, Zhang L, Zhang X, Dou S, Yang J, Zheng S
IEEE Trans Instrum Meas 72: 1-10
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2023,
Wakkary R, Oogjes D, Sakib N, Behzad A
Byrne D, Martelaro N, Boucher A, Chatting D, Fdili Alaoui S, Fox S, Nicenboim I, MacArthur C (eds.): DIS '23: Proceedings of the 2023 ACM Designing Interactive Systems Conference. Association for Computing Machinery (ACM), New York, NY, USA; 790-807; ISBN 978-1-4503-9893-0
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2023,
Budak M, Kiliç MA, Kalkan T, Tuncel H
Indian J Exp Biol 61 (12): 941-945
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2023,
Xu J, Sales Filho J, Nag S, Long L, Hwang E, Tejeiro C, O'Leary G, Huang Y, Kanchwala M, Abdolrazzaghi M, Tang C, Liu P, Sui Y, You H, Liu X, Zariffa J, Genov R
IEEE Trans Biomed Circuits Syst 17 (6): 1237-1256
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2023,
Soares NE, Bulla G, Fernandez-Rodriguez CE, De Salles ÁAA
2023 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC), Castelldefels, Spain. IEEE: 28-30; ISBN 9798350320688
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2023,
Huseynov AN, Malanchuk VA, Myroshnychenko MS, Markovska OV, Sukharieva LP, Kuznetsova MO
Pol Merkur Lek 51 (6): 592-597
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2023,
Sagar A, Kashyap A, Nasab MA, Padmanaban S, Bertoluzzo M, Kumar A, Blaabjerg F
IEEE Access 11: 83703-83751
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2023,
Childress ML, Bruhnke RE, Frandsen CR, Benscoter MA
IEEE Potentials 42 (2): 4-10
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2023 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD), Tianjin, China. IEEE: 1-2; ISBN 9798350301588
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2023,
Hueros V, Barrado A, Lázaro A, Fernández C
2023 IEEE 17th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), Tallinn, Estonia. IEEE: 1-6; ISBN 9798350300055
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2023,
Bajtos M, Radil R, Janoušek L, Bajtos M, Dang N
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: 1-4; ISBN 9798350330359
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2023,
Tuta L, Panait-Radu F, Ardelean F, Gorgoteanu D, Rosu G
Electronics 12 (24): 5003
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2023,
Bertuccio MP, Acri G, Ientile R, Caccamo D, Curro M
Biomedicines 11 (12): 3129
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2023,
Czerwonky DM, Aberra AS, Gomez LJ
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.12.15.571917
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2023,
Nguyen HC, Dam TH, Le MT, Nguyen QC, Nguyen DD
2023 IEEE 9th International Conference on Smart Instrumentation, Measurement and Applications (ICSIMA), Kuala Lumpur, Malaysia. IEEE: 121-126; ISBN 9798350343397
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2023,
Khan MA, Rahim AA, Sethi WT
2023 18th International Conference on Emerging Technologies (ICET), Peshawar, Pakistan. IEEE: 202-206; ISBN 9798350328189
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2023,
Alekhya B, Shabareesh JJRK, Prasad KV, Revanth CVS, Polani P, Swathi D
2023 International Conference on Sustainable Communication Networks and Application (ICSCNA), Theni, India. IEEE: 546-550; ISBN 9798350313994
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2023,
Soares NE, Bulla G, Fernandez-Rodriguez CE, De Salles AAA
2023 IEEE MTT-S Latin America Microwave Conference (LAMC), San José, Costa Rica. IEEE: 58-60; ISBN 9798350316414
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2023,
Yao B, Men J, Liu S, Bai Y, Yu C, Gao Y, Xu X, Zhao L, Zhang J, Wang H, Li Y, Peng R
Electromagn Biol Med 42 (4): 150-162
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-3; ISBN 9798350333114