キーワード:
Mittelwert, "arithmetischer Mittelwert", Mittel, "arithmetic mean", "mean value", mean, 算術平均, 平均値, 平均
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2024,
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2024,
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2024,
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2024,
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2024,
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2023,
Farzan R, Ziabari SMZ, Jafaryparvar Z, Homaierad E, Ismaili Shoja E, Tolouei M
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2023,
Cayo-Cabrera GH, Basurco-Chambilla TR, Cayo-Cabrera NL, Huertas-Flores EB, Angulo-Mamani LE
2023 IEEE Colombian Caribbean Conference (C3), Barranquilla, Colombia. IEEE: 1-5; ISBN 9798350341805
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2023,
Mustafa BT, Yaba SP, Ismail AH
2023 9th International Engineering Conference on Sustainable Technology and Development (IEC), Erbil, Iraq. IEEE: 32-37; ISBN 9798350335071
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2023,
Xie G, Fang M, Huang Z, Wu X, Ren X, Feng N
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Sangle V, Male V, Sanap S, Maniyar A, Ugale G, Gundre D
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Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: 1-6; ISBN 9798350304015
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2023,
Bhatia N, Dinesh S, Nagesh S
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2023,
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2023,
Rabiei M, Masoumi SJ, Mortazavi SMJ, Nematolahi S, Haghani M
J Biomed Phys Eng 13 (6): 497-502
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2023,
Casal D, Casimiro MH, Ferreira LM, Leal JP, Rodrigues G, Lopes R, Moura DL, Gonçalves L, Lago JB, Pais D, Santos PMP
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2023,
Ranjbar N, Bakhshandeh B, Pennisi CP
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2023,
Patil N, Korenfeld O, Scalf RN, Lavoie N, Huntemer-Silveira A, Han G, Swenson R, Parr AM
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2023,
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2023,
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2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: 1-4; ISBN 9798350324488
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2023,
Chacko TP, Toole JT, Morris MC, Page J, Forsten RD, Barrett JP, Reinhard MJ, Brewster RC, Costanzo ME, Broderick G
Front Psychiatry 14: 1180929
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2023,
Zhai T, Zilli Vieira CL, Vokonas P, Baccarelli AA, Nagel ZD, Schwartz J, Koutrakis P
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2023,
Liu Z, Wen X, Shao Y, Wan Z, Liu B, Wang R, Liu H
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2023,
Wang Q, Zhu X, Meng X, Zhong H
Acta Biomater 172: 382-394
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2023,
Gorban C, Zhang Z, Mensen A, Khatami R
Brain Sci 13 (11): 1609
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2023,
Reddy DP, Earan SK, Kalaimani T, Arunagirinathan A
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2023,
Miclaus S, Deaconescu DB, Vatamanu D, Buda AM
Technologies 11 (5): 113