キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2015,
Bamba A, Gaillot DP, Tanghe E, Vermeeren G, Joseph W, Lienard M, Martens L
IEEE Trans Electromagn Compat 57 (6): 27-34
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2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 611-614; ISBN 978-1-4799-3226-9
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2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 974-979; ISBN 978-1-4799-3226-9
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 364-368; ISBN 978-1-4799-3226-9
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 369-374; ISBN 978-1-4799-3226-9
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2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 360-363; ISBN 978-1-4799-3226-9
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2014,
Kavya M, Yashodhara B, Arunachalam V, Devendranath D, Yellaiah A, Rashmi, Sailaja RRN
2014 International Conference on Power Signals Control and Computations (EPSCICON), Thrissur, India. IEEE: pp. 1-6
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2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: p. 14737980; ISBN 978-1-84919-911-7
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 354-359; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 348-353; ISBN 978-4-88552-287-1
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2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 745-748; ISBN 978-4-88552-287-1
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2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 226-229; ISBN 978-4-88552-287-1
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2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 202-205; ISBN 978-4-88552-287-1
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 449-452; ISBN 978-4-88552-287-1
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2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 190-193; ISBN 978-4-88552-287-1
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2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 537-540; ISBN 978-4-88552-287-1
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 186-189; ISBN 978-4-88552-287-1
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2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 426-429; ISBN 978-4-88552-287-1
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2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 635-637; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 832-835; ISBN 978-4-88552-287-1
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 194-197; ISBN 978-4-88552-287-1
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2014,
Iwamoto T, Arima T, Uno T, Iwamoto T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 162-165; ISBN 978-4-88552-287-1
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 650-653; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 625-628; ISBN 978-4-88552-287-1
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 621-624; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 206-209; ISBN 978-4-88552-287-1
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 61786-1 VDE 0848-786-1:2014-10
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2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969
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2014,
Seidman S, LaSorte N
IEEE Electromagn Compat Mag 3 (3): 49-54
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2014,
Chen XL, Umenei AE, Baarman DW, Chavannes N, De Santis V, Mosig JR, Kuster N
IEEE Trans Electromagn Compat 56 (5): 1027-1034
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2014,
Gutierrez O, Navarro MA, de Adana FS, Escobar A, Moncada ME, Muñoz CM
J Electromagn Anal 6 (7): 141-155
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2014,
Seidman SJ, Bekdash O, Guag J, Mehryar M, Booth P, Frisch P
Biomed Eng Online 13: 110
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2014,
Seidman SJ, Pantchenko O, Tennakoon D
IEEE Electromagn Compat Mag 3 (1): 70-74
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2014,
Le DT, Iyama T, Hamada L, Watanabe S, Onishi T
IEEE Electromagn Compat Mag 3 (1): 57-64
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2014,
Colombi D, Thors B, Jonsson BLG
IEEE Trans Electromagn Compat 56 (3): 539-548
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Dokument Nr. R1174712004: 1-63
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: pp. 1-6; ISBN 978-1-5090-1885-7
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: pp. 1-4; ISBN 978-1-5090-1885-7