キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2015,
Kamimura Y, Sato Y, Yamashita A, Nagaoka T, Wake K
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 1416-1419; ISBN 978-1-4799-6615-8
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2015,
Kim BC, Kim S-M, Moon J-I, Kwon J-H, Cho I-K
2015 IEEE Global Electromagnetic Compatibility Conference (GEMCCON), Adelaide, SA, Australia. IEEE: pp. 1-3; ISBN 978-1-4673-8548-0
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2015,
Istanbullu OB, Akdogan G
[2015 Medical Technologies National Conference (TIPTEKNO), Bodrum, Turkey]. IEEE: pp. 1-4; ISBN 978-1-4673-7765-2
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2015,
Lee AK, Hong SE, Kwon JH, Choi HD
IEEE Trans Electromagn Compat 57 (5): 1281-1284
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Journal of the Chinese Institute of Engineers 38 (6): 760-769
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2015,
Frikha A, Bensetti M, Pichon L, Lafon F, Duval F, Benjelloun N
IEEE Trans Electromagn Compat 57 (6): 1481-1490
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2015,
Apreutesei AL, Curteza A, Baltag O
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest. IEEE: pp. 352-355; ISBN 978-1-4799-7514-3
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2015,
Costea M, Baran I, Leonida T
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest. IEEE: pp. 331-336; ISBN 978-1-4799-7514-3
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2015,
Seckler T, Jagielski K, Stunder D
Int J Environ Res Public Health 12 (6): 5886-5904
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2015,
Chakarothai J, Shi J, Wang J, Fujiwara O, Wake K, Watanabe S
IEEE Electromagn Compat Mag 4 (1): 57-66
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2015,
Lee WS, Oh KS, Yu JW
IEEE Antennas Wirel Propag Lett 14: 1459-1462
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2015,
Vassilev A, Ferber A, Wehrmann C, Pinaud O, Schilling M, Ruddle AR
IEEE Trans Electromagn Compat 57 (6): 35-43
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2015,
Ardavan M, Trueman CW, Schmitt KA
IEEE Trans Electromagn Compat 57 (6): 69-79
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2015,
Bamba A, Gaillot DP, Tanghe E, Vermeeren G, Joseph W, Lienard M, Martens L
IEEE Trans Electromagn Compat 57 (6): 27-34
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2014,
Alasonati E, Comino E, Ianoz M, Korovkin N, Rachidi F, Schaefer D, Zryd JP, Zweiacker P
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 991-995; ISBN 978-4-88552-287-1
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2014,
Fukunaga K, Watanabe S, Wake K, Yamanaka Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 763-767; ISBN 978-4-88552-287-1
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2014,
Cipollone A, Fabbri A, Zendri E
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1003-1007; ISBN 978-4-88552-287-1
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2014,
Giusti G, Licitra G, Lusini D, Silvi AM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Cerri G, De Leo R, Russo P, Micheli D
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Catarinucci L, Palazzari P, Tarricone L
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 959-964; ISBN 978-4-88552-287-1
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2014,
Borio E, Crotti G, Rinaudo A, Scaglione M, Spisani A, Zucca M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1035-1039; ISBN 978-4-88552-287-1
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2014,
Haga A, Matsuki H, Endo G
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 997-1001; ISBN 978-4-88552-287-1
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2014,
Sacco B, Scotti A, Confalonieri C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Mizuno Y, Naito K, Isaka K, Yonemura I, Hasekura H
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1009-1014; ISBN 978-4-88552-287-1
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2014,
D'Inzeo G, Apollonio F, Liberti M, Ardoino L, Lovisolo GA
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 981-984; ISBN 978-4-88552-287-1
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2014,
Mori F, Sorrentino R, Strappini M, Tarricone L
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Cortina R, Masetti C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Bellan B, Betti P, Carillo D, D’Amore M, D’Arco M, De Capua C, Gaggelli A, Grandolfo M, Maradei F, Mariscotti A, Pignari S, Pozzobon P, Rossi P, Violi AG
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1201-1204; ISBN 978-4-88552-287-1
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2014,
Poljak D, Sarolic A, Roje V
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 965-968; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-21; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 751-756; ISBN 978-4-88552-287-1
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2014,
Bit-Babik G, Faraone A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Sarolic A, Modlic B, Roje V, Poljak D, Pavic P
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 969-973; ISBN 978-4-88552-287-1
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2014,
Bitz A, Alaydrus M, Streckert J, Hansen VW
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 747-750; ISBN 978-4-88552-287-1
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2014,
Ruffilli L, D'Elia S, Barabino A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Flintoft ID, Porter SJ, Capstick MH, Marvin AC
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Herschlein A, Baldauf M, Sörgel W, Wiesbeck W
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Bernardi P, Cicchetti R, Testa O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Bernardi P, Cavagnaro M, Pisa S, Piuzzi E
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 611-614; ISBN 978-1-4799-3226-9
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2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 974-979; ISBN 978-1-4799-3226-9
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 364-368; ISBN 978-1-4799-3226-9
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 369-374; ISBN 978-1-4799-3226-9
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2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 360-363; ISBN 978-1-4799-3226-9
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2014,
Kavya M, Yashodhara B, Arunachalam V, Devendranath D, Yellaiah A, Rashmi, Sailaja RRN
2014 International Conference on Power Signals Control and Computations (EPSCICON), Thrissur, India. IEEE: pp. 1-6
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2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: p. 14737980; ISBN 978-1-84919-911-7