キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2015,
Kamimura Y, Sato Y, Yamashita A, Nagaoka T, Wake K
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden, Germany. IEEE: pp. 1416-1419; ISBN 978-1-4799-6615-8
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2015,
Kim BC, Kim S-M, Moon J-I, Kwon J-H, Cho I-K
2015 IEEE Global Electromagnetic Compatibility Conference (GEMCCON), Adelaide, SA, Australia. IEEE: pp. 1-3; ISBN 978-1-4673-8548-0
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2015,
Istanbullu OB, Akdogan G
[2015 Medical Technologies National Conference (TIPTEKNO), Bodrum, Turkey]. IEEE: pp. 1-4; ISBN 978-1-4673-7765-2
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2015,
Lee AK, Hong SE, Kwon JH, Choi HD
IEEE Trans Electromagn Compat 57 (5): 1281-1284
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Journal of the Chinese Institute of Engineers 38 (6): 760-769
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2015,
Frikha A, Bensetti M, Pichon L, Lafon F, Duval F, Benjelloun N
IEEE Trans Electromagn Compat 57 (6): 1481-1490
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2015,
Apreutesei AL, Curteza A, Baltag O
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest. IEEE: pp. 352-355; ISBN 978-1-4799-7514-3
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2015,
Costea M, Baran I, Leonida T
2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest. IEEE: pp. 331-336; ISBN 978-1-4799-7514-3
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2015,
Seckler T, Jagielski K, Stunder D
Int J Environ Res Public Health 12 (6): 5886-5904
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2015,
Chakarothai J, Shi J, Wang J, Fujiwara O, Wake K, Watanabe S
IEEE Electromagn Compat Mag 4 (1): 57-66
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2015,
Lee WS, Oh KS, Yu JW
IEEE Antennas Wirel Propag Lett 14: 1459-1462
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2015,
Vassilev A, Ferber A, Wehrmann C, Pinaud O, Schilling M, Ruddle AR
IEEE Trans Electromagn Compat 57 (6): 35-43
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2015,
Ardavan M, Trueman CW, Schmitt KA
IEEE Trans Electromagn Compat 57 (6): 69-79
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2015,
Bamba A, Gaillot DP, Tanghe E, Vermeeren G, Joseph W, Lienard M, Martens L
IEEE Trans Electromagn Compat 57 (6): 27-34
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2014,
Alasonati E, Comino E, Ianoz M, Korovkin N, Rachidi F, Schaefer D, Zryd JP, Zweiacker P
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 991-995; ISBN 978-4-88552-287-1
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2014,
Fukunaga K, Watanabe S, Wake K, Yamanaka Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 763-767; ISBN 978-4-88552-287-1
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2014,
Cipollone A, Fabbri A, Zendri E
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1003-1007; ISBN 978-4-88552-287-1
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2014,
Giusti G, Licitra G, Lusini D, Silvi AM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Cerri G, De Leo R, Russo P, Micheli D
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Catarinucci L, Palazzari P, Tarricone L
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 959-964; ISBN 978-4-88552-287-1
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2014,
Borio E, Crotti G, Rinaudo A, Scaglione M, Spisani A, Zucca M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1035-1039; ISBN 978-4-88552-287-1
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2014,
Haga A, Matsuki H, Endo G
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 997-1001; ISBN 978-4-88552-287-1
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2014,
Sacco B, Scotti A, Confalonieri C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Mizuno Y, Naito K, Isaka K, Yonemura I, Hasekura H
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1009-1014; ISBN 978-4-88552-287-1