キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 832-835; ISBN 978-4-88552-287-1
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 194-197; ISBN 978-4-88552-287-1
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2014,
Arima T, Uno T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1
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2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 650-653; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 625-628; ISBN 978-4-88552-287-1
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2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 621-624; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 206-209; ISBN 978-4-88552-287-1
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 61786-1 VDE 0848-786-1:2014-10
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2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969
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2014,
Seidman S, LaSorte N
IEEE Electromagn Compat Mag 3 (3): 49-54
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2014,
Chen XL, Umenei AE, Baarman DW, Chavannes N, De Santis V, Mosig JR, Kuster N
IEEE Trans Electromagn Compat 56 (5): 1027-1034
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2014,
Gutierrez O, Navarro MA, de Adana FS, Escobar A, Moncada ME, Muñoz CM
J Electromagn Anal 6 (7): 141-155
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2014,
Seidman SJ, Bekdash O, Guag J, Mehryar M, Booth P, Frisch P
Biomed Eng Online 13: 110
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2014,
Seidman SJ, Pantchenko O, Tennakoon D
IEEE Electromagn Compat Mag 3 (1): 70-74
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2014,
Le DT, Iyama T, Hamada L, Watanabe S, Onishi T
IEEE Electromagn Compat Mag 3 (1): 57-64
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2014,
Colombi D, Thors B, Jonsson BLG
IEEE Trans Electromagn Compat 56 (3): 539-548
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Dokument Nr. R1174712004: 1-63