キーワード:
"Wireless Local Area Network", "Drahtloses Netzwerk", WLAN, 無線LAN
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German Bundestag (Parliament of the Federal Republic of Germany),
Drucksache 20/5646: 1-312
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2023,
Davis D, Birnbaum L, Ben-Ishai P, Taylor H, Sears M, Butler T, Scarato T
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2023,
Paniagua-Sánchez JM, García-Cobos FJ, Rufo-Pérez M, Jiménez-Barco A
Sci Total Environ 877: 162852
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2023,
Zheng W, Lan XJ, Qin ZJ, Yang XH, Shi ZM
Front Psychiatry 14: 1111754
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2023,
Tran NT, Jokic L, Keller J, Geier JU, Kaldenhoff R
Plants 12 (5): 1082
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2023,
Henderson S, Bhatt C, Loughran S
Radiat Prot Dosimetry 199 (6): 519-526
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2023,
Saeidi T, Al-Gburi AJA, Karamzadeh S
Sensors 23 (4): 1997
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2023,
Spandole-Dinu S, Catrina AM, Voinea OC, Andone A, Radu S, Haidoiu C, Călborean O, Popescu DM, Suhăianu V, Baltag O, Tuță L, Roșu G
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2023,
Mohamed AO, Hafez SMNA, Ibrahim RA, Rifaai RA
J Chem Neuroanat 129: 102252
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2023,
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Bioelectromagnetics 44 (1-2): 17-25
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2023,
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2023,
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Environ Res 223: 115422
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2023,
Amiri H, Shabkhiz F, Pournemati P, Saffar Kohneh Quchan AH, Zeighami Fard R
Life Sci 317: 121461
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2023,
Pinto R, Ardoino L, Villani P, Marino C
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2023,
Eeftens M, Shen C, Sönksen J, Schmutz C, van Wel L, Liorni I, Vermeulen R, Cardis E, Wiart J, Toledano M, Röösli M
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2023,
Ali EM, Awan WA, Naqvi SI, Alzaidi MS, Alzahrani A, Elkamchouchi DH, Falcone F, Alharbi TEA
Sensors 23 (2): 709
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2023,
Rai AK, Jaiswal RK, Kumari K, Srivastava KV, Sim CYD
IEEE Access 11: 689-696
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2023,
Pophof B, Henschenmacher B, Kattnig DR, Kuhne J, Vian A, Ziegelberger G
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2023,
Chu KY, Khodamoradi K, Blachman-Braun R, Dullea A, Bidhan J, Campbell K, Zizzo J, Israeli J, Kim M, Petrella F, Ibrahim E, Ramasamy R
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2023,
Zhang HH, Gong LF, Liu XZ, Xu YX, Cheng GS, Liu Y, Shi GM, Zheng C, Han YJ
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2023,
Ramirez-Vazquez R, Escobar I, Martinez-Plaza A, Arribas E
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2023,
García-Cobos FJ, Paniagua-Sánchez JM, Gordillo-Guerrero A, Marabel-Calderón C, Rufo-Pérez M, Jiménez-Barco A
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2023,
Liu FX, Cui J, Wang J, Zhao L
IEEE Antennas Wirel Propag Lett 22 (2): 333-336
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2023,
Yamazaki K, Ikeda-Araki A, Miyashita C, Tamura N, Yoshikawa T, Hikage T, Omiya M, Mizuta M, Ikuyo M, Tobita K, Onishi T, Taki M, Watanabe S, Kishi R
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2023,
Bujňáková D, Bucko S, Češkovič M, Kmeť V, Karahutová L
Environ Technol 44 (25): 3813-3819