キーワード:
"Very High Frequency", Ultrakurzwellen, Meterwellen, UKW, VHF
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2023,
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2023,
Zhu H, Yin X, Yang H, Fu R, Hou W, Ding C, Xu G
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
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2023,
Qureshi MRA, Alfadhl Y, Chen X
Ur Rehman M, Jamshed MA (eds.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; pp. 49-75; ISBN 978-1-119-90916-3
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2023,
Brihmat N, Allexandre D, Bayram M, Saleh S, Guan X, Yue GH, Zhong J, Forrest GF
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2023,
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2023,
Pophof B, Henschenmacher B, Kattnig DR, Kuhne J, Vian A, Ziegelberger G
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2023,
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2023,
Chen J, Zeng Y, Hong J, Li C, Zhang X, Wen H
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2023,
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2023,
Guryev GD, Milshteyn E, Giannakopoulos II, Lattanzi R, Wald LL, Adalsteinsson E, White JK
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2023,
Bozok S, Karaagac E, Sener D, Akakin D, Tumkaya L
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2023,
Dey AB, Kumar S, Arif W, Anguera J
IEEE Internet Things J 10 (6): 4952-4969
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2023,
Vignaud P, Adam O, Palm U, Baeken C, Prieto N, Poulet E, Brunelin J
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2023,
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2023,
Abo Aoun M, Meek BP, Clair L, Wikstrom S, Prasad B, Modirrousta M
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2023,
Su X, Haixia L, Xuan W, Pan X, Zhang X, Lu X, Zhao L, Chen Y, Shang Y, Wu F, Xiu M
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2023,
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2023,
Hsiao MY, Choo YJ, Liu IC, Boudier-Revéret M, Chang MC
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2023,
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2023,
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2022,
Chang YC, Ahmed U, Jayaprakash N, Mughrabi I, Lin Q, Wu YC, Gerber M, Abbas A, Daytz A, Gabalski AH, Ashville J, Dokos S, Rieth L, Datta-Chaudhuri T, Tracey KJ, Guo T, Al-Abed Y, Zanos S
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Japanese Railway Engineering No.217: 19-21
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2022,
Kumar S, Simorangkir RBVB, Gawade DR, Quinn AJ, O’Flynn B, Buckley JL
2022 International Workshop on Antenna Technology (iWAT), Dublin, Ireland. IEEE: pp. 90-92; ISBN 978-1-6654-9450-2
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IEEE Antennas Wirel Propag Lett 21 (6): 1075-1079
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2022,
Wang XY, Mei N, Fan X, Wang X, Gao H, Huang YD
2022 International Applied Computational Electromagnetics Society Symposium (ACES-China), Xuzhou, China. IEEE: pp. 1-3; ISBN 978-1-6654-5237-3
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2022,
Grünwald R, Revermann C, Riousset P
Büro für Technikfolgen-Abschätzung beim Deutschen Bundestag (TAB),
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EMIE 2022; The 2nd International Conference on Electronic Materials and Information Engineering, Hangzhou, China. VDE: pp. 1-6; ISBN 978-3-8007-5961-3
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2022,
Annalakshmi N, Umarani S
2022 1st International Conference on Computational Science and Technology (ICCST), CHENNAI, India. IEEE: pp. 701-707; ISBN 978-1-6654-7656-0
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2022,
Matveev I, Zhorina L, Shishkin Y
2022 IEEE International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON), Yekaterinburg, Russian Federation. IEEE: pp. 440-445; ISBN 978-1-6654-6481-9