キーワード:
Proband, Versuchsperson, Testperson, "test person", subject, 被験者
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2020,
Abe G, Oyama H, Liao Z, Honda K, Yashima K, Asao A, Izumi SI
Med Devices 13: 439-447
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J Hum Reprod Sci 13 (3): 174-183
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2020,
Wang J, Li M, Zhu D, Cao Y
J Med Internet Res 22 (12): e21923
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2020,
Khubieva VM, Kugusheva NN, Semenova MN
2020 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon), Vladivostok, Russia. IEEE: 1-6; ISBN 978-1-7281-6952-1
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2020,
Yang L, Su Y, Guo F, Zhang H, Zhao Y, Huang Q, Xu H
Front Integr Neurosci 14: 556839
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2020,
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Sci Rep 10: 5954
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2020,
Sayem ASM, Esselle KP, Hashmi RM
IET Microwaves, Antennas & Propagation 14 (14): 1869-1877
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2020,
Piras C, Conte S, Pibiri M, Rao G, Muntoni S, Leoni VP, Finco G, Atzori L
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2020,
Díaz-Del Cerro E, Vida C, Martínez de Toda I, Félix J, de la Fuente M
Environ Health 19: 118
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Gen Physiol Biophys 39 (6): 531-544
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2020,
Obayashi S, Takahashi R
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2020,
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Int J Mol Sci 21 (22): E8597
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2020,
Wang H, Jin J, Cui D, Wang X, Li Y, Liu Z, Yin T
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Acta Histochem 122 (8): 151652
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2020,
Romanenko S, Harvey AR, Hool L, Wallace VP
2020 IEEE Ukrainian Microwave Week (UkrMW), Kharkiv, Ukraine. IEEE: 612-616; ISBN 978-1-7281-7314-6
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Somatosens Mot Res 37 (4): 300-306
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2020,
Matalatala M, Shikhantsov S, Deruyck M, Tanghe E, Plets D, Goudos S, Martens L, Joseph W
IEEE Access 8: 206371-206387
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2020,
Matsubara K, Wada K, Suzuki Y
2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: 451-455; ISBN 978-1-7281-5827-3
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2020,
Turco CV, Arsalan SO, Nelson AJ
Brain Sci 10 (10): E751
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2020,
Jiang Y, Guo Z, McClure MA, He L, Mu Q
BMC Neurol 20: 377
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2020,
Weber-Rajek M, Strączyńska A, Strojek K, Piekorz Z, Pilarska B, Podhorecka M, Sobieralska-Michalak K, Goch A, Radzimińska A
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2020,
Suri S, Dehghan SF, Sahlabadi AS, Ardakani SK, Moradi N, Rahmati M, Tehrani FR
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2020,
Kim YW, Cui JX, Jin SL, Jee SJ, Sohn MK
J Integr Neurosci 19 (3): 397-404
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2020,
Hendrikse J, Coxon JP, Thompson S, Suo C, Fornito A, Yücel M, Rogasch NC
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2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91