キーワード:
電磁界, "Elektromagnetisches Feld", EMF, "electromagnetic field"
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Am J Transl Res 15 (7): 4699-4708
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2023,
Bassetto M, Reichl T, Kobylkov D, Kattnig DR, Winklhofer M, Hore PJ, Mouritsen H
Nature 620 (7974): 595-599
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2023,
Rahman M, Mahady Dip T, Padhye R, Houshyar S
J Biomed Mater Res A 111 (12): 1916-1950
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2023,
Bajtos M, Dang N, Radil R, Janousek L, Paulecova K
AD ALTA-J Interdiscip Res 13 (1): 308-314
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2023,
Lestini F, Panunzio N, Marrocco G, Occhiuzzi C
IEEE J Electromagn RF Microw Med Biol 7 (4): 365-374
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2023,
Michalowska J, Tomiło P, Pytka J, Puzio L, Tofil A
[航空機内での電界強度の同定]
[tech./dosim.]
Prz Elektrotechniczny 99 (2): 222-225
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2023,
Koziorowska A, Siuta J, Bator E, Krasowski R, Koziorowski M
Prz Elektrotechniczny 99 (2): 202-205
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2023,
An G, Jing Y, Zhao T, Zhang W, Guo L, Guo J, Miao X, Xing J, Li J, Liu J, Ding G
Electromagn Biol Med 42 (2): 41-50
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2023,
Ali B, Rizwan M, Fatima K, Shafqat A, Abbasi S
J Kejuruter 35 (1): 123-132
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2023,
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J Public Health Afr 14 (6): 2347
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J Diabetes Sci Technol: 19322968231190413 [in press]
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2023,
Solazzo M, Monaghan MG
ACS Biomater Sci Eng 9 (8): 4573-4582
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2023,
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J Apic Sci 67 (1): 27-36
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2023,
Zeinelabedeen W, Uyguroglu R
Appl Sci 13 (13): 7786
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2023,
Liu Y, Wang Q, Liu F
Magn Reson Imaging 102: 1-8
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2023,
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Heart Rhythm O2 4 (7): 457-462
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J Integr Neurosci 22 (4): 102
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2023,
Pavčnik M, Antić A, Lukanović A, Krpan Ž, Lukanović D
Medicina 59 (7): 1286
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Biomedicines 11 (7): 1981
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2023,
Flatscher J, Pavez Loriè E, Mittermayr R, Meznik P, Slezak P, Redl H, Slezak C
Int J Mol Sci 24 (14): 11239
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2023,
Gurhan H, Bajtoš M, Barnes F
Biomolecules 13 (7): 1112
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2023,
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Environ Sci Pollut Res 30 (40): 93255-93268
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2023,
Savchenko L, Martinelli I, Marsal D, Batkivska O, Zhdan V, Kaidashev I, Pizzinat N, Boal F, Tronchere H, Tao J, Kunduzova O
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2023,
Benítez-Martínez JC, García-Haba B, Fernández-Carnero S, Pecos-Martin D, Sanchez Romero EA, Selva-Sarzo F, Cuenca-Zaldívar JN
J Pain Res 16: 2553-2566
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2023,
Sârbu A, Cotoi A, Vatamanu D, Neghină C, Miclăuş S
2023 10th International Conference on Modern Power Systems (MPS), Cluj-Napoca, Romania. IEEE: pp. 01-05; ISBN 9798350326833