-
Springer, Cham; ISBN 978-3-030-98773-2
-
Am J Phys 90 (9): 718-719
-
UMID 2: 5-14
-
2022,
Salameh M, Zeitoun-Ghandour S, Sabra L, Ismail L, Daher A, Bazzi A, Khalil M, Joumaa WH
Heliyon 8 (12): e12367
-
2022,
Kim D, Kim M, Lee S, Lee Y, Kim Y
2022 9th International Conference on Condition Monitoring and Diagnosis (CMD), Kitakyushu, Japan. IEEE: 687-690; ISBN 978-1-6654-7015-5
-
2022,
Luo S, Wang Z, Wang H, Chen S
2022 6th International Conference on Communication and Information Systems (ICCIS), Chongqing, China. IEEE: 27-34; ISBN 978-1-6654-6386-7
-
2022,
Nishikawa T, Hikage T, Yamamoto M
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: 124-125; ISBN 978-1-6654-3239-9
-
2022 IEEE ANDESCON, Barranquilla, Colombia. IEEE: 1-7; ISBN 978-1-6654-8855-6
-
2022,
Sekiya K, Ishii N, Shimizu Y, Nagaoka T
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: 79-80; ISBN 978-1-6654-3239-9
-
2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: 1-6; ISBN 978-1-6654-7147-3