-
2023,
Katz BE, Nestor MS, Nuccitelli R, Johnston LJ, Knape WA
J Cosmet Dermatol 22 (5): 1545-1553
-
2023,
Abbas A, Bouttout F, Djellid A
2023 International Conference on Advances in Electronics, Control and Communication Systems (ICAECCS), BLIDA, Algeria. IEEE: pp. 1-5; ISBN 978-1-6654-6311-9
-
2023,
Nordin S, Köteles F, Witthöft M, Van den Bergh O, Nyback MH, Sainio M
Environ Res 229: 115945
-
2023,
Oruç S, Delen K, Yardim A, Aral BS, Kuzay D, Seymen CM, Kaplanoglu GT
Gazi Med J 34 (2): 141-144
-
2023,
Conley MJ, Epifano I, Kirk A, Stevenson A, Graham SV
eBioMedicine 91: 104577
-
2023,
Bahrouni M, Houzet G, Vuong TP, Mendes PM, Dinis H, Silva R, Trabelsi H
Electronics 12 (6): 1475
-
2023,
Kim HK, Kim HJ, Kim JY, Ban MJ, Son J, Hwang Y, Cho SB
Clin Cosmet Investig Dermatol 16: 721-729
-
2023,
Byun KA, Kim HM, Oh S, Son KH, Byun K
Int J Mol Sci 24 (6): 5506
-
2023,
Meng X, Xiao X, Jeon S, Kim D, Park BJ, Kim YJ, Rubab N, Kim S, Kim SW
Adv Mater 35 (12): e2209054
-
2023,
Unal G, Poon C, FallahRad M, Thahsin M, Argyelan M, Bikson M
Brain Stimul 16 (2): 607-618
-
2023,
Rakoczy R, Nowak A, Konopacki M, Kordas M, Kucharski Ł, Ossowicz-Rupniewska P
Eur J Pharm Biopharm 185: 183-189
-
2023,
Kimsa-Dudek M, Synowiec-Wojtarowicz A, Krawczyk A
Mol Biol Rep 50 (5): 4207-4216
-
2023,
Hardell L, Nilsson M
Ann Case Rep 8 (1): 1112
-
2023,
Wang Y, Liu H, Zeng P, Ji L, Zhou Y, Zhou L, Tao Y
Front Neurosci 17: 1114962
-
2023,
Kimsa-Dudek M, Krawczyk A, Synowiec-Wojtarowicz A
Appl Sci 13 (3): 1470
-
2023,
Madl P, Germano R, Tedeschi A, Lettner H
Int J Mol Sci 24 (4): 4099
-
2023,
Kim BR, Kim M, Kim JW, Shin JW, Na JI, Huh CH
Dermatol Surg 49 (4): 389-394
-
2023,
Vergote I, Macarulla T, Hirsch FR, Hagemann C, Miller DS
Cancers 15 (3): 636
-
2023,
Szilágyi Z, Németh Z, Bakos J, Kubinyi G, Necz PP, Szabó E, Thuróczy G, Pinto R, Selmaoui B
Int J Mol Sci 24 (3): 2853
-
2023,
Ali U, Ullah S, Kamal B, Matekovits L, Altaf A
IEEE Access 11: 14458-14486
-
Health Phys 124 (5): 351-371
-
J Therm Eng 9 (1): 257–259
-
2023,
Shaner S, Savelyeva A, Kvartuh A, Jedrusik N, Matter L, Leal J, Asplund M
Lab Chip 23 (6): 1531-1546
-
Environ Res 222: 115369
-
2023,
Li K, Kodera S, Poljak D, Diao Y, Sasaki K, Susnjara A, Prokop A, Taguchi K, Xi J, Zhang S, Yao M, Sacco G, Zhadobov M, El Hajj W, Hirata A
IEEE Access 11: 7420-7435