キーワード:
"electromagnetic field", "Elektromagnetisches Feld", EMF, 電磁界
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2023,
Karpowicz J, Gryz K, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Loh TH, Emrah T, Pythoud F, Fan W, Allal D, Alomainy A
2023 Antenna Measurement Techniques Association Symposium (AMTA), Renton, WA, USA. IEEE: 1-6; ISBN 9798350335668
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2023,
Long X, Pauli M, Li Y, Fritz O, Zwick T
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 259-262; ISBN 9798350347395
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2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
[電磁界の測定についての実験]
[tech./dosim.]
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-6; ISBN 9798350315257
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2023,
Herssens H, Thielens A
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 444-447; ISBN 9798350347395
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2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 263-266; ISBN 9798350347395
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2023,
Askari A, Poursadeghiyan M, Alinia A, Sephvand A, Jafarzadeh E, Nasl-Saraji G, Sahlabadi AS
Iran J Public Health 52 (10): 2157-2168
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2023,
Sincak M, Luptakova A, Matusikova I, Jandacka P, Sedlakova-Kadukova J
Sustainability 15 (19): 14459
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2023,
Kranjc M, Polajzer T, Novickij V, Miklavcic D
Int J Mol Sci 24 (19): 14607
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2023,
El-Kafoury BMA, Abdel-Hady EA, El Bakly W, Elayat WM, Hamam GG, Abd El Rahman SMM, Lasheen NN
Sci Rep 13: 18486
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2023,
Park KW, Kullar P, Malhotra C, Stankovic KM
J Clin Med 12 (20): 6555
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2023,
Venkatachalam D, Jagadeesan V, Ismail KBM, Arun Kumar M, Mahalingam S, Kim J
Bioengineering 10 (10): 1137
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Bioengineering 10 (10): 1176
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Appl Sci 13 (19): 10621
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2023,
Bao J, Pan Z, Wei S
Cureus 15 (10): e47602
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2023,
Bidgoli HA, Schieda N, Rossa C
2023 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Regina, SK, Canada. IEEE: 94-98; ISBN 9798350323986
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2023,
Xu M, Ai K, Deng SF, Liu Q, Zhan LF, Chen XW, Li Y, Kuang JZ, Zhang H
Zhen Ci Yan Jiu 48 (10): 977-985
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2023,
Dziwulska-Hunek A, Niemczynowicz A, Kycia RA, Matwijczuk A, Kornarzyński K, Stadnik J, Szymanek M
Sci Rep 13: 18085
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2023,
Cheon S, Kim J, Kang M
J Magn 28 (3): 304-308
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Diritti Umani Diritto Int 17 (2): 375-404
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2023,
Di Martino G, Di Simone A, Iodice A, Riccio D, Ruello G
2023 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), Portland, OR, USA. IEEE: 49-50; ISBN 978-1-6654-6826-8
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2023,
Tian H, Zhu H, Gao C, Shi M, Yang D, Jin M, Wang F, Sui X
Front Neurosci 17: 1247021
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2023,
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
IEEE J Microw 3 (1): 193-226
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2023,
Martínez JA, Pancorbo M
Rev Environ Health [in press]
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2023,
Yin B, Joseph W, Deruyck M
IEEE Access 11: 115911-115923
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2023,
Baginska U, Moro A, Toonen RF, Verhage M
J Neurosci 43 (45): 7616-7625
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2023,
Gombarska D, Smetana M, Psenakova Z, Boleckova S
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: 1-4; ISBN 9798350330359
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2023,
Salameh M, Zeitoun-Ghandour S, Sabra L, Daher A, Khalil M, Joumaa WH
Sci Rep 13: 17806
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2023,
Prentice A, Barreiros AR, van der Vinne N, Stuiver S, van Dijk H, van Waarde JA, Korgaonkar M, Sack AT, Arns M
Neuropsychobiology 82 (6): 373-383
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2023,
Bodin R, Seewooruttun C, Corona A, Delanaud S, Pelletier A, Villégier AS
Environ Sci Pollut Res 30 (53): 113704-113717
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2023,
Tamura M, Kawamoto T, Ishifuro M, Tamura T, Masumoto Y, Kenjo M, Kiguchi M, Awai K, Nagata Y
J Med Syst 47 (1): 107
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Stem Cells Transl Med 12 (10): 631–650
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2023,
Li K, Hikage T, Masuda H, Ijima E, Nagai A, Taguchi K
Sci Rep 13: 17397
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2023,
Linnemann C, Sahin F, Chen Y, Falldorf K, Ronniger M, Histing T, Nussler AK, Ehnert S
Int J Mol Sci 24 (19): 14629
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2023,
Rahimi S, Ahrabi M, Samiei M, Roshangar L, Ahrabi B, Hashemi B, Shahi S, Rahimi Darehchi N
Iran Endod J 18 (4): 218-223
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2023,
Adda S, Chiaraviglio L, Franci D, Lodovisi C, Pasquino N, Pavoncello S, Pedroli C, Pelosini R
IEEE Trans Instrum Meas 72: 5504410
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2023,
Yang L, Wang B, Li Y
Front Inform Technol Elect Eng 24 (9): 1357-1365
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2023,
Sharma S, Sharma P, Bahel S, Singh J, Katnoria JK
Toxicol Environ Health Sci 15 (4): 385-398
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2023,
Benfedala S, Valero A, Brahmi F, Belbahi A, Kernou ON, Adjeroud-Abdellatif N, Abbou A, Madani K
Food Sci Technol Int [in press]
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2023,
Fu S, Yi S, Ke Q, Liu K, Xu H
ACS Nano 17 (20): 19652–19666
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2023,
Oraby T, Chakraborty S, Sivaganesan S, Kincl L, Richardson L, McBride M, Siemiatycki J, Cardis E, Krewski D
BMC Med Res Methodol 23: 225
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2023,
Baňas M, Šofranková L, Kurimský J, Pavlík M, Pikalík M, Majláthová V, Cimbala R, Pipová N, Wurfl L, Majláth I
Exp Appl Acarol 91 (3): 477-485
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2023,
Mohamed T, Melfi V, Colciago A, Magnaghi V
Cell Death Dis 14 (9): 629
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Cvetković M, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-6; ISBN 9798350301076
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2023,
Kapetanović A, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-5; ISBN 9798350301076
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2023,
Zhang B, Yamauchi Y, Galigekere VP, Onar OC, Mohammad M
2023 IEEE Transportation Electrification Conference & Expo (ITEC), Detroit, MI, USA. IEEE: 1-6; ISBN 9798350397437
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2023,
Walter J, Hader M, Sengedorj A, Fietkau R, Frey B, Gaipl US
Int J Hyperthermia 40 (1): 2265590