キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: pp. 263-266; ISBN 9798350347395
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Campi T, Cecilia V, Mattei E, Boumerdassi W, Rotellini M, Tatangelo G, Feliziani M
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: pp. 1-4; ISBN 9798350309973
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2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: p. 655; ISBN 9798350309775
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 413-418; ISBN 9798350309775
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 608-613; ISBN 9798350309775
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2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
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2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: pp. 1389-1396; ISBN 9798350312850
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2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
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2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
[磁界および電界測定実験]
[tech./dosim.]
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: pp. 61-64; ISBN 9798350341348
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2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: pp. 1-4; ISBN 9798350348323
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IEEE Trans Electromagn Compat 65 (5): 1282-1291
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: pp. 1-4; ISBN 9798350337532
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2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
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2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
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IEEE Trans Electromagn Compat 65 (4): 1090-1097
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2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
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2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
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2023,
Orlacchio R, Andrieu G, Joushomme A, Patrignoni L, Hurtier A, Poulletier de Gannes F, Lagroye I, Percherancier Y, Arnaud-Cormos D, Leveque P
IEEE Trans Electromagn Compat 65 (1): 39-50
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021 (Revision of IEEE Std 149-1977): 1-550, ISBN 9798855711875
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: pp. 101-104; ISBN 978-1-6654-2776-0
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: pp. 606-609; ISBN 978-1-6654-0930-8
