2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 872-874; ISBN 978-1-5090-3955-5
2018,
Li S, Jiang H, Wang B, Gu M, Bi X, Yin Y, Wang Y
2018,
Amoon AT, Crespi CM, Ahlbom A, Bhatnagar M, Bray I, Bunch KJ, Clavel J, Feychting M, Hémon D, Johansen C, Kreis C, Malagoli C, Marquant F, Pedersen C, Raaschou-Nielsen O, Röösli M, Spycher BD, Sudan M, Swanson J, Tittarelli A, Tuck DM, Tynes T, Vergara X, Vinceti M, Wünsch-Filho V, Kheifets L
2018,
Goedhart G, van Wel L, Langer CE, de Llobet Viladoms P, Wiart J, Hours M, Kromhout H, Benke G, Bouka E, Bruchim R, Choi KH, Eng A, Ha M, Huss A, Kiyohara K, Kojimahara N, Krewski D, Lacour B, 't Mannetje A, Maule M, Migliore E, Mohipp C, Momoli F, Petridou ET, Radon K, Remen T, Sadetzki S, Sim M, Weinmann T, Cardis E, Vrijheid M, Vermeulen R