-
J Therm Eng 7 (2): 103-116
-
2021,
Pedrosa MB, Tenorio BM, Angelo FdasCAM, Nogueira de Morais R, Nogueira RdeA, Silva Junior VAda
Acta Sci Health Sci 43: e53934
-
2021,
Aydin F, Aksit E, Aydin AH, Yildirim OT
Konuralp Tip Derg 13 (1): 130-134
-
2021,
Mahmoud EA, Gabarty A
Afr Entomol 29 (1): 32-41
-
2021,
Taufiq F, Babu MB, Ahmad A, Shariff MEA, Elbadawi NE, Meerasa SS
J Pharm Res Int 33 (13): 54-60
-
2021,
Liu L, Deng H, Tang X, Lu Y, Zhou J, Wang X, Zhao Y, Huang B, Shi Y
Proc Natl Acad Sci USA 118 (31): e2105838118
-
2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 697-702; ISBN 978-1-6654-4889-5
-
2021,
Jakubowska M, Greszkiewicz M, Fey DP, Otremba Z, Urban-Malinga B, Andrulewicz E
Mar Freshw Res 72 (8): 1196-1207
-
2021,
Lopez JI, Bermeo LA
2021 IEEE 2nd International Congress of Biomedical Engineering and Bioengineering (CI-IB&BI), Bogota D.C., Colombia. IEEE: 341633; ISBN 978-1-6654-0855-4
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 2889-2021: 1-152, ISBN 978-1-5044-8015-4