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2014 IEEE PES T&D Conference and Exposition, Chicago, IL, USA. IEEE: pp. 373-377; ISBN 978-1-4799-3657-1
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 354-359; ISBN 978-1-4799-3226-9
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2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 348-353; ISBN 978-1-4799-3226-9
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Alistar BD, Salceanu A, Lupuleasa G
2014 International Conference and Exposition on Electrical and Power Engineering (EPE), Iasi, Romania. IEEE: pp. 437-441; ISBN 978-1-4799-5849-8
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Koizumi M, Suga R, Saito K, Ito K
2014 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-Bio2014), London, UK. IEEE: pp. 1-3; ISBN 978-1-4799-5445-2
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International Conference on Information Communication and Embedded Systems (ICICES2014), Chennai, India. IEEE: p. 14915635; ISBN 978-1-4799-3835-3
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IEEE Antennas Propag Mag 56 (6): 256-258
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Novikov VV, Sheĭman IM, Iablokova EV, Fesenko EE
Biofizika 59 (6): 1157-1160
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Environnement, Risques & Santé 13 (6): 440-443
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Wong ET, Lok E, Swanson KD, Gautam S, Engelhard HH, Lieberman F, Taillibert S, Ram Z, Villano JL
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International Electrotechnical Commission (IEC),
IEC 61786-2:2014: 1-71, ISBN 978-2-8-3221970-6
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Bioelectromagnetics 35 (8): 607-613
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Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
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The 7th 2014 Biomedical Engineering International Conference, Fukuoka, Japan. IEEE: pp. 1-3; ISBN 978-1-4799-6800-8
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2014,
Karabetsos E, Kalampaliki E, Koutounidis D
IEEE Vehicular Technology Magazine 9 (4): 34-39
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2014,
Echchgadda I, Grundt JE, Cerna CZ, Roth CC, Ibey BL, Wilmink GJ
2014 39th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz), Tucson, AZ, USA. IEEE: p. 14770846; ISBN 978-1-4799-3877-3
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2014,
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J Radiol Prot 34 (2): N31-N39
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2014,
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PLoS One 9 (2): e89904
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IEEE Antennas Propag Mag 56 (1): 219
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2014,
Lucia U, Ponzetto A, Deisboeck TS
Sci Rep 4: 6763
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2014,
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J Adhes Dent 16 (5): 407-413
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: pp. 745-748; ISBN 978-4-88552-287-1
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