-
2017,
Mireku MO, Mueller W, Fleming C, Chang I, Dumontheil I, Thomas MSC, Eeftens M, Elliott P, Röösli M, Toledano MB
Environ Res 161: 1-8
-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62704-3:2017: 1-76, ISBN 978-1-5044-4261-9
-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62704-2:2017: 1-112, ISBN 978-1-5044-4116-2
-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62704-1:2017: 1-86, ISBN 978-1-5044-4259-6
-
2017,
Mohammed B, Jin J, Abbosh A, Bialkowski K, Manoufali M, Crozier S
IEEE Access 5: 27345 - 27353
-
2017,
Ji X, Zheng J, Chen J
Electromagn Biol Med 36 (4): 379-386
-
2017,
Miceli S, Ness TV, Einevoll GT, Schubert D
eNeuro 4 (1)
-
Electromagn Biol Med 36 (4): 341-356
-
2017,
Ghatei N, Nabavi AS, Toosi MHB, Azimian H, Homayoun M, Targhi RG, Haghir H
Iran J Basic Med Sci 20 (9): 1037-1043
-
2017,
Kouzani AZ, Kale RP, Zarate-Garza PP, Berk M, Walder K, Tye SJ
IEEE Trans Neural Syst Rehabil Eng 25 (9): 1365-1374
-
2017,
Capelli E, Torrisi F, Venturini L, Granato M, Fassina L, Lupo GFD, Ricevuti G
J Healthc Eng 2017: 2530270
-
2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
-
2017 40th International Conference on Telecommunications and Signal Processing (TSP), Barcelona. IEEE; ISBN 978-1-5090-3983-8
-
2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
-
2017,
Huang HD, Santaniello S
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: pp. 1954-1957; ISBN 978-1-5090-2810-8
-
2017,
Deng ZD, Lisanby SH
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: pp. 1445-1448; ISBN 978-1-5090-2810-8
-
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: pp. 2060-2063; ISBN 978-1-5090-2810-8
-
2017,
Bonmassar G, Golestanirad L
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju, Korea (South). IEEE: pp. 3576-3579; ISBN 978-1-5090-2810-8
-
2017,
Chen Z, Solbach K, Erni D, Rennings A
IEEE Trans Biomed Eng 64 (6): 1297-1304
-
2017,
Vermeulen R, Koeman T, Kromhout H
Occup Environ Med 74 (12): 925-926
-
Int J Mol Sci 18 (10)
-
2017,
Haider M, Russer JA
2017 International Conference on Electromagnetics in Advanced Applications (ICEAA), Verona. IEEE, Verona, Italy: pp. 1490-1493; ISBN 978-1-5090-4451-1
-
2017,
Grzesik M, Górnik K, Janas R, Lewandowki M, Romanowska-Duda Z, Duijn BV
J Plant Physiol 219: 81-90
-
2017,
Krause MR, Zanos TP, Csorba BA, Pilly PK, Choe J, Phillips ME, Datta A, Pack CC
Curr Biol 27 (20): 3086-3096.e3
-
2017,
Kapri-Pardes E, Hanoch T, Maik-Rachline G, Murbach M, Bounds PL, Kuster N, Seger R
Cell Physiol Biochem 43 (4): 1533-1546