キーワード:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 525-530; ISBN 978-1-6654-0789-2
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2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 151-156; ISBN 978-1-6654-0789-2
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 145-150; ISBN 978-1-6654-0789-2
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2022,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 114-119; ISBN 978-1-6654-0789-2
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 311-316; ISBN 978-1-6654-0789-2
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2022,
Esmaeili H, Yang C, Schuster C
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 467-472; ISBN 978-1-6654-0789-2
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2022,
Marina P, Suárez SD, Hernández JA, Febles VM, Rabassa LE, Ramos V
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 519-524; ISBN 978-1-6654-0789-2
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2022,
Johansson M, Carlsson J
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 137-140; ISBN 978-1-6654-0789-2
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2022,
Zhou C, Synder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 439-442; ISBN 978-1-6654-0930-8
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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 306-308; ISBN 978-1-6654-1672-6
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2022,
Guo R, Xia M, Zheng J, Chen J, Shrivastava D
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 210-212; ISBN 978-1-6654-1672-6
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2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 261-263; ISBN 978-1-6654-1672-6
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2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
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2022,
Grazian F, Shi W, Soeiro TB, Dong J, Bauer P
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: 54-59; ISBN 978-1-6654-8446-6
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2022,
Zimmer S, Helwig M, Winkler A, Modler N
Electronics 11 (14): 2156
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2022,
Kapetanović AL, Poljak D
IEEE Trans Electromagn Compat 64 (5): 1296-1303
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Energies 15 (12): 4455
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2022,
Bertoluzzo M, Di Barba P, Forzan M, Mognaschi ME, Sieni E
Eng Comput 39 (7): 2802-2819
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2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
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2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
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2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
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IEEE Trans Electromagn Compat 64 (4): 941-950
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2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
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2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
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2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649