キーワード:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
-
2013,
van Bree JWM, Geysen JJG, van Heesch EJM, Pemen AJM
IEEE Trans Plasma Sci 41 (10): 2654-2658
-
IEEE Trans Electromagn Compat 55 (2): 275-287
-
2013,
Straessner R, Eing C, Goettel M, Gusbeth C, Frey W
IEEE Trans Plasma Sci 41 (10): 2951-2958
-
2013,
Rodriguez CJ, Vanella OR, Bruni RG, Taborda RAM
IEEE Latin America Transactions 11 (1): 319-323
-
2013,
Paffi A, Merla C, Pinto R, Lovisolo GA, Liberti M, Marino C, Repacholi M, Apollonio F
IEEE Trans Microw Theory Tech 61 (5): 1980-1993
-
2013,
Christ A, Douglas MG, Roman JM, Cooper EB, Sample AP, Waters BH, Smith JR, Kuster N
IEEE Trans Electromagn Compat 55 (2): 265-274
-
2013,
Mi Y, Jiang C, Yao C, Li C
IEEE Trans Dielectr Electr Insul 20 (4): 1327-1333
-
2013,
Boriskin AV, Zhadobov M, Steshenko S, Le Drean Y, Le Coq L, Person C, Sauleau R
IEEE Trans Microw Theory Tech 61 (5): 2005-2014
-
2013,
De Santis V, Chen XL, Laakso I, Hirata A
Phys Med Biol 58 (24): 8597-8607
-
2013,
Kim JH, Kim DW, Chang WH, Kim YH, Im CH
2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Osaka, Japan. IEEE: 823-825; ISBN 978-1-4577-0216-7