キーワード:
"power transmission line", Hochspannungsfreileitung, Hochspannungsleitung, "high-voltage line", "transmission line", "power line", HVOTL, 高電圧線, 送電線, 電力線
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2023,
Dong L, Chen Y, Wang K, Li H, Di G
Int Immunopharmacol 125 Pt A: 111006
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2023,
Naresh Chandra Naik, Nibash Kumar Sahu, Tapas Kumar Patra
2023 1st International Conference on Circuits, Power and Intelligent Systems (CCPIS), Bhubaneswar, India. IEEE: pp. 1-5; ISBN 9798350315776
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2023,
Tian H, Zhu H, Gao C, Shi M, Yang D, Jin M, Wang F, Sui X
Front Neurosci 17: 1247021
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2023,
Martínez JA, Pancorbo M
Rev Environ Health [in press]
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Goutman SA, Savelieff MG, Jang DG, Hur J, Feldman EL
Nat Rev Neurol 19 (10): 617-634
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2023,
Subedi TR, Perez-Garcia JM, Gurung S, Baral HS, Bhattacharjee A, Anadon JD, Virani MZ, Thomsett S, Buij R
Bird Conserv Int 33: e73
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2023,
Shiina T, Sekiba Y, Yamazaki K
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: pp. 1-4; ISBN 9798350309973
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2023,
Canicattì E, Sánchez-Bayuela DÁ, Romero Castellano C, Aguilar Angulo PM, Giovanetti González R, Cruz Hernández LM, Ruiz Martín J, Tiberi G, Monorchio A
Diagnostics 13 (18): 3015
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2023,
Kursawe M, Kaifie A, Krabbe J, Kimpeler S, Kühn R, Kraus T, Jankowiak K
Sci Rep 13: 16320
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2023,
Szabó D, Gyergyádesz L, Németh B, Ramirez-Bettoni E
2023 IEEE Power & Energy Society General Meeting (PESGM), Orlando, FL, USA. IEEE: pp. 1-5; ISBN 978-1-6654-6442-0
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: pp. 413-418; ISBN 9798350309775
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2023,
Brzozek C, Karipidis K
Public Health Res Pract 33 (3): 3332325
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2023,
Guo H, Kang L, Qin W, Li Y
Altern Ther Health Med 29 (8): 75-81
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2023,
Huber P, Mohanty P, Jenau F
2023 IEEE Electrical Insulation Conference (EIC), Quebec City, QC, Canada. IEEE: pp. 1-4; ISBN 978-1-6654-9342-0
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2023,
Sekiba Y, Kodera S, Yamazaki K, Hirata A
IEEE Access 11: 95455-95466
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2023,
Nygård T, Jacobsen KO, Gjershaug JO
Ornis Fenn 100 (2): 99-111
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2023,
Dwyer JF, Karyakin IV, Garrido López JR, Nikolenko EG
Ardeola 70 (1): 3-27
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2023,
Chavan PK, Autade SB, Pardeshi DB, William P
2023 5th International Conference on Inventive Research in Computing Applications (ICIRCA), Coimbatore, India. IEEE: pp. 1714-1718; ISBN 9798350321432
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Actual Jurid Ambient (134): 4-34
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2023,
Nguyen A, Crespi CM, Vergara X, Kheifets L
Environ Res 238 Pt 1: 116899
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2023,
Zhou F, Ma C, Li YJ, Zhang M, Liu W
Afr J Reprod Health 27 (5): 95-104
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2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
[磁界および電界測定実験]
[tech./dosim.]
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: pp. 61-64; ISBN 9798350341348
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2023,
Hirota R, Teramoto A, Chiba M, Onuma M, Narimatsu H, Yotsuyanagi T, Yamashita T
Spine Surg Relat Res 7 (4): 410-413
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2023,
Dündar AS, Altın İ, Aksöz C, Sarın AB, Özdemir B
J Forensic Sci 68 (6): 2076-2084
