キーワード:
"magnetische Feldstärke", H-Feld, "magnetic field strength", "H field", 磁界強度
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2019,
Bodewein L, Schmiedchen K, Dechent D, Stunder D, Graefrath D, Winter L, Kraus T, Driessen S
Environ Res 171: 247-259
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2019,
Tang C, Yang C, Cai RS, Ye H, Duan L, Zhang Z, Shi Z, Lin K, Song J, Huang X, Zhang H, Yang J, Cai P
Sci Total Environ 654: 535-540
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2019,
Yamaguchi T, Abe Y, Ichino Y, Satoh S, Masuda T, Kimura S, Ito M, Yamamoto T
J Magn Reson Imaging 49 (2): 525-533
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2019,
Kamm K, Pomschar A, Ruscheweyh R, Straube A, Reiser MF, Hernádi I, László JF, Ertl-Wagner B
Eur J Pain 23 (2): 250-259
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2018,
Attaran A, Handler WB, Chronik BA
2018 IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS), Windsor, ON, Canada. IEEE: pp. 45-48; ISBN 978-1-5386-7393-5
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2018,
Shuai CJ, Xie XC, Li RM, Wang XK
Acta Microsc 27 (3): 202-208
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2018,
Ma L, Zhang X, Ying BA, Wu L
Li Y, Gao L, Xu WL (eds.): 11th Textile Bioengineering and Informatics Symposium proceedings (TBIS 2018) : Manchester, United Kingdom, 25-28 July 2018. Curran Associates, Inc., Red Hook, NY; pp. 205-211; ISBN 978-1-5108-7035-2
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2018,
Drandić A, Trkulja B
Engineering Analysis with Boundary Elements 91: 1-6
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2018,
Zaidi S, Khatoon S, Imran M, Zohair S
Pak J Bot 50 (6): 2237-2244
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 24-27; ISBN 978-1-5090-3955-5