キーワード:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2024,
Esmaeili H, Yang C, Schuster C
IEEE Trans Electromagn Compat [in press]
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Access 12: 109750-109758
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2024,
Di Capua G, Maffucci A, Capriglione D, Di Mambro G, Femia N, Oliva N, De Guglielmo L
2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy. IEEE: 1-6; ISBN 9798350370546
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2024,
Ishida K, Fujii K, Hanada E
J Med Syst 48 (1): 72
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2024,
Li B, Zhang X, Qiao N, Chen J, Bi W, Zhi W, Ma L, Miao C, Wang L, Zou Y, Hu X
Bioelectromagnetics [in press]
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2024,
Li J, Dengyu Z, Yujie Z, Yuechen G
2024 IEEE 7th International Electrical and Energy Conference (CIEEC), Harbin, China. IEEE: 3488-3491; ISBN 9798350359565
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2024,
Zhan L, Shi D, Zhou X, Gou Y
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: 159-162; ISBN 9798350349498
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2024,
Sufian MA, Abbas A, Choi D, Lee J, Hussain N, Kim N
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: 247-249; ISBN 9798350349498
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2024,
Kuster N, Xi J, Christ A
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: 251-254; ISBN 9798350349498
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2024,
Censi F, Vivarelli C, Mattei E, Calcagnini G, Bogi A, Comelli M, Zoppetti N, Burriesci G, D’Agostino S, Falsaperla R
2024 4th URSI Atlantic Radio Science Meeting (AT-RASC), Meloneras, Spain. IEEE, Spanien: 1-4; ISBN 9798350360257
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2024,
Diao Y, Kodera S, Li K, Hirata A
IEEE Trans Electromagn Compat [in press]
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Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D3, Jun 2024: 1-65, ISBN 9798855709759
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2024,
Ali Hamed SM, Alsaif H
IEEE Access 12: 89353-89362
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2024,
Yang X, Guo R, Zheng J, Chen X, Chen J
IEEE Trans Electromagn Compat 66 (4): 1029-1040
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2024,
Dianovský R, Pecho P, Hrúz M, Velký P
2024 New Trends in Civil Aviation (NTCA), Prague, Czech Republic. IEEE: 133-139; ISBN 9798350317961
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat 66 (3): 1015-1028
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat 66 (3): 706-719
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2024,
Vivarelli C, Censi F, Calcagnini G, Falsaperla R, Mattei E
Health Phys 127 (2): 269-275
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2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat 66 (3): 720-727
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Energies 17 (1): 126
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2024,
Quercio M, Lozito GM, Corti F, Riganti Fulginei F, Laudani A
IEEE Access 12: 16728-16740
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat 66 (2): 417-426
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2024,
Vivarelli C, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A, Mattei E
IEEE Trans Electromagn Compat 66 (1): 97-107
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2024,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst 18 (2): 460-473