キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: pp. 1-4; ISBN 9798350337532
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2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
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2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
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IEEE Trans Electromagn Compat 65 (4): 1090-1097
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2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
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2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
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2023,
Orlacchio R, Andrieu G, Joushomme A, Patrignoni L, Hurtier A, Poulletier de Gannes F, Lagroye I, Percherancier Y, Arnaud-Cormos D, Leveque P
IEEE Trans Electromagn Compat 65 (1): 39-50
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021 (Revision of IEEE Std 149-1977): 1-550, ISBN 9798855711875
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2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: pp. 101-104; ISBN 978-1-6654-2776-0
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2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: pp. 606-609; ISBN 978-1-6654-0930-8
