キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: pp. 162-166; ISBN 978-1-6654-9221-8
-
2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Swiss Federal Office of Energy (SFOE),
Statusbericht 2022: 1-204
-
2022,
Krupski P, Michalowska J
Prz Elektrotechniczny 98 (12): 217-220
-
2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: pp. 1-6; ISBN 978-1-6654-7147-3
-
IEEE Electromagn Compat Mag 11 (3): 20-21
-
2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
-
2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 537-542; ISBN 978-1-6654-0789-2
-
2022,
Pavel I, David V, Roman MG, Bordas AM
2022 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: pp. 484-488; ISBN 978-1-6654-8995-9
-
2022,
Xia M, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: pp. 610-613; ISBN 978-1-6654-0930-8
-
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: pp. 319-322; ISBN 978-1-6654-2776-0
-
2022,
Diao Y, Rashed EA, Hirata A
IEEE Trans Electromagn Compat 64 (6): 1969-1977
-
2022,
Colombi D, Ghasemifard F, Joshi P, Xu B, Di Paola C, Törnevik C
IEEE Trans Electromagn Compat 64 (6): 1986-1993
-
2022,
ElShami IF, Elwrfalli K, Elgayar AI, Elgaud MM, Yousuf FH, Elmangosh N
2022 International Conference on Engineering & MIS (ICEMIS), Istanbul, Turkey. IEEE: pp. 1-5; ISBN 978-1-6654-5437-7
-
2022,
Li S, Jiang Y, Tang C, Luo Z, Liu L, Li Z, Gu C
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: pp. 563-565; ISBN 978-1-6654-1672-6
-
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 525-530; ISBN 978-1-6654-0789-2
-
2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 151-156; ISBN 978-1-6654-0789-2
-
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 145-150; ISBN 978-1-6654-0789-2
-
2022,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 114-119; ISBN 978-1-6654-0789-2
-
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 311-316; ISBN 978-1-6654-0789-2
-
2022,
Esmaeili H, Yang C, Schuster C
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 467-472; ISBN 978-1-6654-0789-2
-
2022,
Marina P, Suárez SD, Hernández JA, Febles VM, Rabassa LE, Ramos V
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 519-524; ISBN 978-1-6654-0789-2
-
2022,
Johansson M, Carlsson J
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 137-140; ISBN 978-1-6654-0789-2
-
2022,
Zhou C, Synder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: pp. 439-442; ISBN 978-1-6654-0930-8
-
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: pp. 306-308; ISBN 978-1-6654-1672-6
-
2022,
Guo R, Xia M, Zheng J, Chen J, Shrivastava D
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: pp. 210-212; ISBN 978-1-6654-1672-6