キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2025,
Mustapha AA, Gaya S, Hassan OS, Abou-Khousa MA
Measurement 242 Pt D: 116134
-
2024,
Dumitru D, Barkhaus PE, Nandedkar SD
Muscle Nerve [in press]
-
2024,
Zhou WY, Xu JJ, Lu M, Li YX
Phys Scr 99 (12): 125513
-
2024,
Litzbarski LS, Olesz M, Redlarski G, Tojza PM, Zak A, Gifuni E, Cieslikowska Z, Czaplinski M
Appl Sci 14 (21): 9668
-
2024,
Roman MG, Adochiei IR, Adochiei FC
Costin HN, Magjarević R, Petroiu GG (eds.): Advances in Digital Health and Medical Bioengineering, Vol 1, EHB-2023, Bucharest. IFMBE Proceedings, 109巻; Springer, Cham; pp. 367-374; ISBN 978-3-031-62501-5
-
2024,
Ketelhut S, Zutz H, Hupe O
J Radiol Prot 44 (4): 041510
-
2024,
Karnas G, Maslowski G
IEEE Trans Electromagn Compat [in press]
-
2024,
Kodera S, Kimura S, Uehara S, Yuasa A, Ushizawa K, Otaka Y, Hirata A
IEEE Trans Electromagn Compat [in press]
-
2024,
Umadevi V, Ranganathan S
2024 15th International Conference on Computing Communication and Networking Technologies (ICCCNT), Kamand, India. IEEE: pp. 1-6; ISBN 9798350370270
-
2024,
Anjitha V, Sunitha K
IEEE Trans Electromagn Compat [in press]
-
IEEE Trans Electromagn Compat [in press]
-
2024,
Yamaguchi-Sekino S, Ikuyo M, Tobita K, Onishi T, Taki M, Watanabe S
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 573-578; ISBN 9798350343045
-
2024,
Cruciani S, Campi T, Maradei F, Feliziani M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 816-820; ISBN 9798350343045
-
2024,
Hassab Y, Esmaeili H, Schuster C
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 584-589; ISBN 9798350343045
-
2024,
Faraone A, Bit-Babik G, Russo P, De Leo A, Mariani Primiani V, De Santis V
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 957-960; ISBN 9798350343045
-
2024,
Miwa K, Ota S, Kawai K
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 92-97; ISBN 9798350343045
-
2024,
Ankarson P, Bergqvist B
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 590-594; ISBN 9798350343045
-
2024,
Bellosono L, D’ Agostino S, Colella M, Contessa GM, Polichetti A, Liberti M, Apollonio F
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 579-583; ISBN 9798350343045
-
2024,
Stroka S, Haussmann N, Kasolis F, Clemens M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 762-767; ISBN 9798350343045
-
2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 369-373; ISBN 9798350360400
-
2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400
-
2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 604-607; ISBN 9798350360400
-
2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 359-364; ISBN 9798350360400
-
2024,
Cvetković M, Poljak D, Dodig H
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 167-172; ISBN 9798350360400
-
2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 446-449; ISBN 9798350360400
-
2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53
-
2024,
Jacksha RD, Sunderman CB, Zhou C
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 205-210; ISBN 9798350360400
-
2024,
Xiao S, Zhang ZQ, Su TZ, Zhang JB, Xiao Jia
2024 International Conference on Electromagnetics in Advanced Applications (ICEAA), Lisbon, Portugal. IEEE: pp. 250-253; ISBN 9798350360981
-
2024,
Pandeya M, Solanki MS, Suresh VG
2024 2nd World Conference on Communication & Computing (WCONF), RAIPUR, India. IEEE: pp. 1-5; ISBN 9798350395334
-
2024,
Cruciani S, Campi T, Maradei F, Feliziani M
Energies 17 (17): 4233
-
2024,
Akter MK, Guo R, Islam MZ, Zheng J, Kainz W, Long SA, Chen J
IEEE Trans Electromagn Compat 66 (4): 1041-1056
-
2024,
Esmaeili H, Yang C, Schuster C
IEEE Trans Electromagn Compat [in press]
-
2024,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Access 12: 109750-109758
-
2024,
Di Capua G, Maffucci A, Capriglione D, Di Mambro G, Femia N, Oliva N, De Guglielmo L
2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy. IEEE: pp. 1-6; ISBN 9798350370546
-
2024,
Ishida K, Fujii K, Hanada E
J Med Syst 48 (1): 72
-
2024,
Li B, Zhang X, Qiao N, Chen J, Bi W, Zhi W, Ma L, Miao C, Wang L, Zou Y, Hu X
Bioelectromagnetics 45 (7): 338-347
-
2024,
Li J, Dengyu Z, Yujie Z, Yuechen G
2024 IEEE 7th International Electrical and Energy Conference (CIEEC), Harbin, China. IEEE: pp. 3488-3491; ISBN 9798350359565
-
2024,
Zhan L, Shi D, Zhou X, Gou Y
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 159-162; ISBN 9798350349498
-
2024,
Sufian MA, Abbas A, Choi D, Lee J, Hussain N, Kim N
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 247-249; ISBN 9798350349498
-
2024,
Kuster N, Xi J, Christ A
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 251-254; ISBN 9798350349498
-
2024,
Censi F, Vivarelli C, Mattei E, Calcagnini G, Bogi A, Comelli M, Zoppetti N, Burriesci G, D’Agostino S, Falsaperla R
2024 4th URSI Atlantic Radio Science Meeting (AT-RASC), Meloneras, Spain. IEEE, Spanien: pp. 1-4; ISBN 9798350360257
-
2024,
Diao Y, Kodera S, Li K, Hirata A
IEEE Trans Electromagn Compat 66 (5): 1351-1360
-
Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D4, Aug 2024: 1-65, ISBN 9798855712186
-
Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D3, Jun 2024: 1-65, ISBN 9798855709759
-
2024,
Ali Hamed SM, Alsaif H
IEEE Access 12: 89353-89362
-
2024,
Yang X, Guo R, Zheng J, Chen X, Chen J
IEEE Trans Electromagn Compat 66 (4): 1029-1040
-
2024,
Dianovský R, Pecho P, Hrúz M, Velký P
2024 New Trends in Civil Aviation (NTCA), Prague, Czech Republic. IEEE: pp. 133-139; ISBN 9798350317961
-
2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
-
2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat 66 (3): 1015-1028
-
2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat 66 (3): 706-719