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2019,
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2019 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia), Bangkok, Thailand. IEEE: pp. 36-38; ISBN 978-1-7281-3337-9
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2019,
Taormina B, Di Poi C, Agnalt AL, Carlier A, Desroy N, Escobar-Lux RH, D'eu JF, Freytet F, Durif CMF
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2019,
Tan SZ, Tan PC, Luo LQ, Chi YL, Yang ZL, Zhao XL, Zhao L, Dong J, Zhang J, Yao BW, Xu XP, Tian G, Chen JK, Wang H, Peng RY
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2019,
Zhang J, Liu Y, Cui C, Wang Z, Cui S, Zhu C
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: pp. 1-5; ISBN 978-1-7281-3399-7
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2019,
Ibrahim AU, Zhong W, Cui H, Li H, Xu D
2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA. IEEE: pp. 4575-4579; ISBN 978-1-7281-0396-9
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2019,
Rathebe PC, Modisane DS, Rampedi MB, Biddesay-Manila S, Mbonane TP
2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 219-221; ISBN 978-1-7281-3465-9
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2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030