2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 205-210; ISBN 9798350360400
2024,
Gao H, Cole JP, Landry TO, Biberston JD, Guetersloh SB, Cardin S, Erwin WJ, Muffoletto IM, Benda JA, Kelly ER, Escobar RF, Voorhees WB, Wells KH, Stone R II, Tadlock MD, How RA, Van Gent JM, Gurney JM