-
2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 International Symposium on Antennas and Propagation (ISAP), Sydney, Australia. IEEE: pp. 277-278; ISBN 978-1-6654-7963-9
-
2022,
Kim D, Kim M, Lee S, Lee Y, Kim Y
2022 9th International Conference on Condition Monitoring and Diagnosis (CMD), Kitakyushu, Japan. IEEE: pp. 687-690; ISBN 978-1-6654-7015-5
-
2022,
Luo S, Wang Z, Wang H, Chen S
2022 6th International Conference on Communication and Information Systems (ICCIS), Chongqing, China. IEEE: pp. 27-34; ISBN 978-1-6654-6386-7
-
2022,
Amicucci GL, Settino MT
2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME), Maldives, Maldives. IEEE: pp. 1-7; ISBN 978-1-6654-7096-4
-
J Comput Methods Sci Eng 22 (6): 2257-2266
-
2022,
Nishikawa T, Hikage T, Yamamoto M
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: pp. 124-125; ISBN 978-1-6654-3239-9
-
2022,
Sekiya K, Ishii N, Shimizu Y, Nagaoka T
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: pp. 79-80; ISBN 978-1-6654-3239-9
-
2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: pp. 37-38; ISBN 978-1-6654-3239-9
-
2022,
Zhou H, Zhang R, Tian Y, Peng H, Wang H, Mao J
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA. IEEE: pp. 1-3; ISBN 978-1-6654-9195-2
-
2022,
Pawełek A, Acheaw Owusu S, Cecchetti D, Zielińska A, Wyszkowska J
Environ Evid 11: 37
