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2024,
Khan R, Sethi WT, Faisal F
2024 International Conference on Engineering & Computing Technologies (ICECT), Islamabad, Pakistan. IEEE, Pakistan: pp. 01-06; ISBN 9798350349726
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2024,
Zhan L, Shi D, Zhou X, Gou Y
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 159-162; ISBN 9798350349498
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2024,
Ma Y, Liu C, Huang Y, Ke H, Liu X
IEEE J Electromagn RF Microw Med Biol [in press]
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2024,
Sufian MA, Abbas A, Choi D, Lee J, Hussain N, Kim N
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 247-249; ISBN 9798350349498
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2024,
Kuster N, Xi J, Christ A
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 251-254; ISBN 9798350349498
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2024,
Chiaramello E, Chiasserini CF, Malandrino F, Nordio A, Parazzini M, Valcarce A
2024 IEEE 25th International Symposium on a World of Wireless, Mobile and Multimedia Networks (WoWMoM), Perth, Australia. 25巻; IEEE, Australien: pp. 167-176; ISBN 9798350394672
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2024,
Wang H, Xu S, Yu J, Lu S, Zhu Y, Du P
2024 5th International Seminar on Artificial Intelligence, Networking and Information Technology (AINIT), Nanjing, China. 5巻; IEEE, China: pp. 1926-1929; ISBN 9798350385564
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2024,
Liu J, Zhang Y, Chikha WB, Wang S, Samaras T, Jawad O, Ourak L, Conil E, Wiart J
2024 4th URSI Atlantic Radio Science Meeting (AT-RASC), Meloneras, Spain. IEEE, Spanien: pp. 1-3; ISBN 9798350360257
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2024,
Herssens H, Thielens A
2024 4th URSI Atlantic Radio Science Meeting (AT-RASC), Meloneras, Spain. IEEE, Spanien: pp. 1-4; ISBN 9798350360257
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2024,
Diao Y, Kodera S, Li K, Hirata A
IEEE Trans Electromagn Compat 66 (5): 1351-1360