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2021,
Ahumada C, Kaschel H, Osorio-Comparan R
2021 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON), Valparaíso, Chile. IEEE: 1-5; ISBN 978-1-6654-0874-5
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2021,
Sekiya K, Ishii N, Shimizu Y, Nagaoka T
2021 IEEE Conference on Antenna Measurements & Applications (CAMA), Antibes Juan-les-Pins, France. IEEE: 16-21; ISBN 978-1-7281-9698-5
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2021,
Omi S, Sasaki K, Nagaoka T
2021 IEEE Conference on Antenna Measurements & Applications (CAMA), Antibes Juan-les-Pins, France. IEEE: 22-24; ISBN 978-1-7281-9698-5
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2021,
Ajibare AT, Ramotsoela D
2021 International Conference on Electrical, Computer and Energy Technologies (ICECET), Cape Town, South Africa. IEEE: 1-6; ISBN 978-1-6654-4232-9
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2021,
Song DJ, Zhang Y, Xie J, Liu YJ, Yang HW
Radiat Eff Defects Solids 176 (11-12): 1146-1159
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2021,
Tai YK, Chan KKW, Fong CHH, Ramanan S, Yap JLY, Yin JN, Yip YS, Tan WR, Koh APF, Tan NS, Chan CW, Huang RYJ, Li JZ, Fröhlich J, Franco-Obregón A
Front Oncol 11: 783803
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2021,
Kurup HB, Remsha M, Antony D, Rodrigues S
2021 10th International Conference on Internet of Everything, Microwave Engineering, Communication and Networks (IEMECON), Jaipur, India. IEEE: 1-4; ISBN 978-1-6654-2687-9
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International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K. 91 Supplement 1 (05/2021): 1-44
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2021,
Nour AA, Shubitidze F
2021 Photonics & Electromagnetics Research Symposium (PIERS), Hangzhou, China. IEEE: 462-466; ISBN 978-1-6654-0988-9
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2021,
Kim SH, Park YH, Lee H, Lee SE, Park JH, Lee KH, Kim YH
Anaesth Pain Intensive Care 25 (6): 741-745